FIFTH AMENDMENT TO THE CREDIT AGREEMENTCredit Agreement • May 5th, 2006 • Viasystems Inc • Printed circuit boards • New York
FIFTH AMENDMENT, dated as of May 1, 2006 (the “Amendment”), to the Credit Agreement, dated as of January 31, 2003, as amended by the First Amendment dated as of March 19, 2003, the Second Amendment dated as of December 3, 2003, the Third Amendment and First Waiver dated as of October 7, 2004 and the Fourth Amendment dated as of April 22, 2005 (the “Credit Agreement”), among VIASYSTEMS GROUP, INC. (“Holdings”), VIASYSTEMS, INC. (the “Borrower”), the several banks and other financial institutions from time to time parties thereto (the “Lenders”) and JPMORGAN CHASE BANK, N.A., as administrative agent for the Lenders (in such capacity, the “Administrative Agent”).
SECOND AMENDMENT TO STOCK PURCHASE AGREEMENTStock Purchase Agreement • May 5th, 2006 • Viasystems Inc • Printed circuit boards
THIS SECOND AMENDMENT TO STOCK PURCHASE AGREEMENT (this “Amendment”) is made effective as of April 28, 2006 by and among Electrical Components International Holdings Company, a Delaware corporation (“Purchaser”), Viasystems Group, Inc., a Delaware corporation (“Parent”), Wire Harness Holding Company, Inc., a Delaware corporation (“Seller”), and Wire Harness Industries, Inc., a Delaware corporation and a direct wholly-owned subsidiary of Seller (the “Company”).
FIRST AMENDMENT TO STOCK PURCHASE AGREEMENTStock Purchase Agreement • May 5th, 2006 • Viasystems Inc • Printed circuit boards
THIS FIRST AMENDMENT TO STOCK PURCHASE AGREEMENT (this “Amendment”) is made effective as of April 4, 2006 by and among Electrical Components International Holdings Company, a Delaware corporation (“Purchaser”), Viasystems Group, Inc., a Delaware corporation (“Parent”), Wire Harness Holding Company, Inc., a Delaware corporation (“Seller”), and Wire Harness Industries, Inc., a Delaware corporation and a direct wholly-owned subsidiary of Seller (the “Company”).
TERMINATION AND RELEASETermination and Release Agreement • May 5th, 2006 • Viasystems Inc • Printed circuit boards • New York
THIS TERMINATION AND RELEASE (this “Agreement”) dated as of May 1, 2006, is made by and among Viasystems, Inc., a Delaware corporation (the “Company”), Wire Harness Industries, Inc., a Delaware corporation (“Industries”), Wire Harness Contractors, Inc., a Delaware corporation and wholly owned subsidiary of Industries (“Contractors” and together with Industries, the “Guarantors” and each a “Guarantor”), and The Bank of New York, as trustee under the indenture described below (the Trustee”).
