AGREEMENTAgreement • March 31st, 1998 • Viasystems Inc • Printed circuit boards
1 EXHIBIT 10.13 VIASYSTEMS GROUP, INC. STOCK OPTION AGREEMENT THIS AGREEMENT (the "Agreement") is made and entered into between Viasystems Group, Inc., a Delaware corporation ("Corporation"), and the undersigned (the "Holder") in connection with the...Stock Option Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards • Delaware
RECITALS:Agreement and Plan of Merger • June 20th, 1997 • Viasystems Inc • Delaware
1 EXHIBIT 10.22 EXECUTIVE EMPLOYMENT AGREEMENT This Agreement is made and entered into as of the 1st day of January, 1997 by and among Circo Technologies Group, Inc. ("Circo"), Circo Craft Technologies, Inc. and Circo Craft Co. Inc. (all, including...Executive Employment Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards • Missouri
andShare Purchase Agreement • October 15th, 1999 • Viasystems Inc • Printed circuit boards • Hong Kong
FIRST AMENDMENT FIRST AMENDMENT, dated as of August 29, 1997 (this "Amendment"), to the Second Amended and Restated Credit Agreement, dated as of June 5, 1997 (as the same may be further amended, supplemented or otherwise modified from time to time,...Viasystems Inc • March 31st, 1998 • Printed circuit boards • New York
RECITALS:Agreement and Plan of Merger • June 20th, 1997 • Viasystems Inc • Delaware
3- 4 and any other agreement or instrument entered into or to be entered into in connection with the Transactions, contemplated hereby or thereby, including, without limitation, the Agreement and Plan of Merger of Chips Acquisition, Inc. and the...Viasystems Inc • June 20th, 1997 • New York
JANUARY 1998 AGREEMENTViasystems Inc • March 31st, 1998 • Printed circuit boards
1 EXHIBIT 10.12 VIASYSTEMS GROUP, INC. STOCK OPTION AGREEMENT THIS AGREEMENT (the "Agreement") is made and entered into between Viasystems Group, Inc., a Delaware corporation ("Corporation"), and the undersigned (the "Holder") in connection with the...Stock Option Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards • Delaware
1 EXHIBIT 2.1 SECURITIES PURCHASE AGREEMENT THIS SECURITIES PURCHASE AGREEMENT (this "Agreement"), dated as of October 1, 1996, is entered into among CIRCO CRAFT HOLDING COMPANY, a Delaware corporation (the "Company"), and the Purchasers listed on the...Securities Purchase Agreement • June 20th, 1997 • Viasystems Inc • Texas
1 EXHIBIT 10.26 VIASYSTEMS, INC. 9 3/4% Series B Senior Subordinated Notes due 2007 PURCHASE AGREEMENTViasystems Inc • March 31st, 1998 • Printed circuit boards • New York
1 EXHIBIT 4.4 SECOND AMENDED AND RESTATED CREDIT AGREEMENTCredit Agreement • June 20th, 1997 • Viasystems Inc • New York
AGREEMENT BETWEENAgreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards
THIRD AMENDMENT THIRD AMENDMENT, dated as of November 10, 1998 (this "Amendment"), to the Second Amended and Restated Credit Agreement, dated as of June 5, 1997 (as the same may be further amended, amended and restated, supplemented or otherwise...Viasystems Inc • March 30th, 1999 • Printed circuit boards • New York
EXHIBIT 4.5 AMENDED AND RESTATED GUARANTEE AND COLLATERAL AGREEMENTGuarantee and Collateral Agreement • June 20th, 1997 • Viasystems Inc • New York
1 EXHIBIT 10.27 Viasystems, Inc. 9 3/4% Series B Senior Subordinated Notes due 2007 EXCHANGE AND REGISTRATION RIGHTS AGREEMENTViasystems Inc • March 31st, 1998 • Printed circuit boards • New York
1 EXHIBIT 10.15 THIRD AMENDED AND RESTATED FINANCIAL ADVISORY AGREEMENT THIS THIRD AMENDED AND RESTATED FINANCIAL ADVISORY AGREEMENT (this "Agreement") is made and entered into effective as of June 6, 1997, among Viasystems Group, Inc., a Delaware...Financial Advisory Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards • Texas
INDENTUREIndenture • March 31st, 1998 • Viasystems Inc • Printed circuit boards • New York
1 EXHIBIT 10.14 THIRD AMENDED AND RESTATED MONITORING AND OVERSIGHT AGREEMENT THIS THIRD AMENDED AND RESTATED MONITORING AND OVERSIGHT AGREEMENT (this "Agreement") is made and entered into effective as of June 6, 1997, among Viasystems Group, Inc., a...Monitoring and Oversight Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards • Texas
1 EXHIBIT 10.19 EXECUTIVE EMPLOYMENT AGREEMENT This agreement is made and entered into as of the 16th day of October, 1998 by and among Viasystems Group, Inc. ("Corporation"), Viasystems, Inc. ("Viasystems") and Viasystems Technologies Corp....Executive Employment Agreement • March 30th, 1999 • Viasystems Inc • Printed circuit boards • Missouri
1 EXHIBIT 10.23 EXECUTIVE EMPLOYMENT AGREEMENT This agreement is made and entered into as of the 1st day of January, 1997 by and among Circo Technologies Group, Inc. ("Corporation") and Circo Craft Technologies, Inc. ("Circo Craft"); (both Corporation...Executive Employment Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards • Missouri
RECITALS:4 Agreement and Plan of Merger • June 20th, 1997 • Viasystems Inc • Delaware
1 EXHIBIT 10.20 EXECUTIVE EMPLOYMENT AGREEMENT This Agreement is made and entered into as of the 1st day of January, 1997 by and among Circo Technologies Group, Inc. ("Circo"), Circo Craft Technologies, Inc. ("Technologies") and Circo Craft Co. Inc....Executive Employment Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards • Missouri
AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENTExecutive Employment Agreement • November 14th, 2005 • Viasystems Inc • Printed circuit boards • Missouri
This Agreement is made and entered into as of the 15th day of August, 2005 by and among Viasystems Group, Inc. ("Viasystems") and, Viasystems, Inc. ("Inc." and, together with Viasystems and the other subsidiaries of Viasystems set forth on the signature pages hereto, "Employer"), and Gerald G. Sax ("Employee").
FOURTH AMENDMENT TO THE CREDIT AGREEMENTThe Credit Agreement • March 30th, 2005 • Viasystems Inc • Printed circuit boards • New York
FOURTH AMENDMENT, dated as of March 18, 2005 (the “Amendment”), to the Credit Agreement, dated as of January 31, 2003, as amended by the First Amendment dated as of March 19, 2003, the Second Amendment dated as of December 3, 2003 and the Third Amendment and First Waiver dated as of October 7, 2004 (the “Credit Agreement”), among VIASYSTEMS GROUP, INC. (“Holdings”), VIASYSTEMS, INC. (the “Borrower”), the several banks and other financial institutions from time to time parties thereto (the “Lenders”) and JPMORGAN CHASE BANK, N.A., as administrative agent for the Lenders (in such capacity, the “Administrative Agent”).
RECITALS:Acquisition Agreement • June 20th, 1997 • Viasystems Inc • New York
June 15, 2005 David J. Webster St. Louis, MO 63105 Dear Dave:Viasystems Inc • March 31st, 2006 • Printed circuit boards
Reference is hereby made to that certain Amended and Restated Executive Employment Agreement dated as of January 31, 2003 by and among Viasystems Group, Inc. (“Group” and, together with its subsidiaries parties thereto, “Viasystems”) and David J. Webster (“Employee”). Group is currently exploring the sale of the wire harness division (the “Division”). In connection therewith, Employee and Wire Harness Industries, Inc. entered into an agreement (the “Harness Agreement”) dated as of June _15_, 2005.
1 EXHIBIT 10.18 EXECUTIVE EMPLOYMENT AGREEMENT This Agreement is made and entered into as of the 1st day of January, 1997 by and among Circo Technologies Group, Inc. ("Circo"), Circo Craft Technologies, Inc. and Circo Craft Co. Inc. (all, including...Executive Employment Agreement • July 31st, 1997 • Viasystems Inc • Printed circuit boards • Missouri
STOCK PURCHASE AGREEMENT BY AND AMONG ELECTRICAL COMPONENTS INTERNATIONAL HOLDINGS COMPANY, VIASYSTEMS GROUP, INC., WIRE HARNESS HOLDING COMPANY, INC. AND WIRE HARNESS INDUSTRIES, INC. Dated as of March 21, 2006Stock Purchase Agreement • March 22nd, 2006 • Viasystems Inc • Printed circuit boards • New York
This STOCK PURCHASE AGREEMENT, dated as of March 21, 2006 (this “Agreement”), is entered into by and among Electrical Components International Holdings Company, a Delaware corporation (“Purchaser”), Viasystems Group, Inc., a Delaware corporation (“Parent”), Wire Harness Holding Company, Inc., a Delaware corporation and an indirect wholly-owned subsidiary of Parent (“Seller”), and Wire Harness Industries, Inc., a Delaware corporation and a direct wholly-owned subsidiary of Seller (the “Company”).
AGREEMENTAgreement • August 23rd, 2006 • Viasystems Inc • Printed circuit boards
US$80,000,000 CREDIT FACILITIES for VIASYSTEMS KALEX PRINTED CIRCUIT BOARD LIMITED VIASYSTEMS ASIA PACIFIC COMPANY LIMITED KALEX CIRCUIT BOARD (CHINA) LIMITED arranged by UBS AG HONG KONG BRANCH with UBS AG, SINGAPORE BRANCH as Facility Agent and UBS AG, SINGAPORE BRANCH as Security Agent 17 August, 2006
VIASYSTEMS, INC. AND EACH OF THE GUARANTORS PARTY HERETO 12.00% SENIOR SECURED NOTES DUE 2015 INDENTURE Dated as of November 24, 2009 Wilmington Trust FSB TrusteeMonitoring and Oversight Agreement • December 2nd, 2009 • Viasystems Inc • Printed circuit boards • New York
INDENTURE dated as of November 24, 2009 among Viasystems, Inc., a Delaware corporation (the “Company”), the Guarantors party hereto and Wilmington Trust FSB, as trustee (the “Trustee”).
RECITALSEnvironmental, Health and Safety Agreement • June 20th, 1997 • Viasystems Inc • New York
Dated August17, 2009 between Guangzhou Termbray Electronics Technology Co., Ltd as Borrower and China Construction Bank Guangzhou Economic and Technological Development District Branch as Lender CREDIT FACILITY CONTRACTCredit Facility Contract • September 10th, 2009 • Viasystems Inc • Printed circuit boards
Guangzhou Termbray Electronics Technology Co., Ltd, located at 888 Jiu Fu West Road, Jiu Long Town, Luo Gang District, Guangzhou P.R.C. 510555 with Mr. Daniel J. Weber as its legal representative (or principal officer) and its fax number 020-8781-1571 and its telephone number 020-8749-0139 (“Party A”);
FIFTH AMENDMENT TO THE CREDIT AGREEMENTCredit Agreement • May 5th, 2006 • Viasystems Inc • Printed circuit boards • New York
FIFTH AMENDMENT, dated as of May 1, 2006 (the “Amendment”), to the Credit Agreement, dated as of January 31, 2003, as amended by the First Amendment dated as of March 19, 2003, the Second Amendment dated as of December 3, 2003, the Third Amendment and First Waiver dated as of October 7, 2004 and the Fourth Amendment dated as of April 22, 2005 (the “Credit Agreement”), among VIASYSTEMS GROUP, INC. (“Holdings”), VIASYSTEMS, INC. (the “Borrower”), the several banks and other financial institutions from time to time parties thereto (the “Lenders”) and JPMORGAN CHASE BANK, N.A., as administrative agent for the Lenders (in such capacity, the “Administrative Agent”).
