EXHIBIT 10.13 LOAN AND SECURITY AGREEMENTLoan Agreement • June 25th, 2002 • California Micro Devices Corp • Electronic components & accessories • California
Contract Type FiledJune 25th, 2002 Company Industry Jurisdiction
EXHIBIT 10.12 CONFIDENTIAL TREATMENT REQUESTED. CONFIDENTIAL PORTIONS OF THIS DOCUMENT HAVE BEEN REDACTED AND HAVE BEEN SEPARATELY FILED WITH THE SECURITIES AND EXCHANGE COMMISSION. WAFER MANUFACTURING AGREEMENT Introduction This Wafer Manufacturing...Wafer Manufacturing Agreement • June 25th, 2002 • California Micro Devices Corp • Electronic components & accessories • Hong Kong
Contract Type FiledJune 25th, 2002 Company Industry Jurisdiction