Intel, Samsung, TSMC Reach Agreement for 450mm Wafer Manufacturing TransitionWafer Manufacturing Agreement • May 7th, 2022
EX-10.18 10 dex1018.htm WAFER MANUFACTURING AGREEMENT WAFER MANUFACTURING AGREEMENTWafer Manufacturing Agreement • May 5th, 2020 • California
THIS WAFER MANUFACTURING AGREEMENT (“Agreement”) is entered into as of October 6, 2005, by and between SunPower Corporation, a California corporation (“SunPower”), Cypress Semiconductor Corporation (“Cypress”), a Delaware corporation (“Manufacturer”).
THIS WAFER MANUFACTURING AGREEMENT (this Wafer Agreement) is entered into as of November 7, 1996, by and between PARADIGM TECHNOLOGY, INC., a corporation ------------------------- organized under the laws of Delaware, with offices at 71 Vista Montana,...Wafer Manufacturing Agreement • December 2nd, 1996 • Paradigm Technology Inc /De/ • Semiconductors & related devices • California
EXHIBIT 10.12 CONFIDENTIAL TREATMENT REQUESTED. CONFIDENTIAL PORTIONS OF THIS DOCUMENT HAVE BEEN REDACTED AND HAVE BEEN SEPARATELY FILED WITH THE SECURITIES AND EXCHANGE COMMISSION. WAFER MANUFACTURING AGREEMENT Introduction This Wafer Manufacturing...Wafer Manufacturing Agreement • June 25th, 2002 • California Micro Devices Corp • Electronic components & accessories • Hong Kong
CONFIDENTIAL TREATMENT REQUESTED WAFER MANUFACTURING AGREEMENTWafer Manufacturing Agreement • February 25th, 2003 • California Micro Devices Corp • Electronic components & accessories • Hong Kong
This Wafer Manufacturing Agreement (this “Agreement”) is entered into by and between California Micro Devices Corporation, a corporation formed under the laws of, and with a place of business and office in, California USA (“CAMD”), and Advanced Semiconductor Manufacturing Corporation of Shanghai, a corporation formed under the laws of, and with an office and place of business in, the Peoples Republic of China (“ASMC”), effective upon the later of the dates (the “Effective Date”) it is signed by a representative of each party under Authorized Signatures below.
CONFIDENTIAL TREATMENT REQUESTED WAFER MANUFACTURING AGREEMENTWafer Manufacturing Agreement • August 6th, 2004 • California Micro Devices Corp • Electronic components & accessories • California
This Wafer Manufacturing Agreement (this “Agreement”) is entered into by and between California Micro Devices Corporation, a corporation formed under the laws of, and with a place of business and office in, California USA (“CAMD”), and SANYO Electric Co., Ltd. Semiconductor Company, a corporation formed under the laws of, and with a place of business and an office in, Japan (“SANYO”) effective upon the later of the dates (the “Effective Date”) it is signed by a representative of each party under Authorized Signatures below .
