CONFIDENTIAL TREATMENT REQUESTED WAFER MANUFACTURING AGREEMENTWafer Manufacturing Agreement • February 25th, 2003 • California Micro Devices Corp • Electronic components & accessories • Hong Kong
Contract Type FiledFebruary 25th, 2003 Company Industry JurisdictionThis Wafer Manufacturing Agreement (this “Agreement”) is entered into by and between California Micro Devices Corporation, a corporation formed under the laws of, and with a place of business and office in, California USA (“CAMD”), and Advanced Semiconductor Manufacturing Corporation of Shanghai, a corporation formed under the laws of, and with an office and place of business in, the Peoples Republic of China (“ASMC”), effective upon the later of the dates (the “Effective Date”) it is signed by a representative of each party under Authorized Signatures below.
CALIFORNIA MICRO DEVICES CORPORATION EXECUTIVE DEFERRED COMPENSATION AGREEMENTExecutive Deferred Compensation Agreement • February 25th, 2003 • California Micro Devices Corp • Electronic components & accessories • California
Contract Type FiledFebruary 25th, 2003 Company Industry JurisdictionTHIS AGREEMENT, made and entered into as of this day of by and between California Micro Devices Corporation, a California corporation, (hereinafter referred to as the “Company” or the “Employer”) with offices located at 215 Topaz Street, Milpitas, California 95035 and that executive employee indicated on the signature page hereto, an individual (hereinafter referred to as the “Employee”).