EXHIBIT 10.21 LOAN AGREEMENT SECURED BY PROPERTY ----------------------------------Loan Agreement • February 20th, 1998 • Applied Micro Circuits Corp • Semiconductors & related devices • California
EXHIBIT 10.23 LOAN AND PLEDGE AGREEMENT ------------------------- THIS LOAN AND PLEDGE AGREEMENT (the "AGREEMENT") is made as of February 19, 1998, between Applied Micro Circuits Corporation, a Delaware corporation ("LENDER"), and Anil Bedi ("BORROWER").Loan and Pledge Agreement • February 20th, 1998 • Applied Micro Circuits Corp • Semiconductors & related devices
EXHIBIT 10.22 NOTE SECURED BY DEED OF TRUSTNote Secured by Deed of Trust • February 20th, 1998 • Applied Micro Circuits Corp • Semiconductors & related devices • California
