W I T N E S S E T H:Settlement Agreement • August 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Exhibit 10.76 RESTRUCTURING SETTLEMENT AND MUTUAL RELEASE AGREEMENT This Restructuring, Settlement and Mutual Release Agreement (this "Agreement") is entered into as of this 14th day of April, 1998, by and among Microelectronic Packaging, Inc....Restructuring Settlement and Mutual Release Agreement • August 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
EXHIBIT 10.80 FORBEARANCE, RESTRUCTURE AND MUTUAL RELEASE AGREEMENT ---------------------------- This Forbearance, Restructure and Mutual Release Agreement (the "Agreement") is entered into as of this 1st day of July, 1998, by and among...Forbearance, Restructure and Mutual Release Agreement • August 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
