AMENDMENT ---------Restructuring, Settlement and Mutual Release Agreement • November 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
AMENDMENT --------- RESTRUCTURING, SETTLEMENT AND MUTUAL RELEASE AGREEMENT This Amendment to the Restructuring, Settlement and Mutual Release Agreement (this "Agreement") is entered into as of November 24, 1998 by and among Microelectronic Packaging,...Restructuring, Settlement and Mutual Release Agreement • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
EXHIBIT 10.86 AMENDMENT --------- RESTRUCTURING, SETTLEMENT AND MUTUAL RELEASE AGREEMENT This Amendment No. 1 is entered into as of September 1, 1998 by and among Microelectronic Packaging, Inc. ("MPI"), and Transpac Capital Pte. Ltd. ("Transpac"),...Restructuring, Settlement and Mutual Release Agreement • November 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
