EXHIBIT 10.72 VIA FAX AND EMAIL January 19, 1999 Mr. Thomas J. Gentry Vice President, Corporate Staff Manager, Treasury Services Texas Instruments Incorporated P.O. Box 650311 MS 3994 Dallas, TX 75265 RE: Conditional Agreement Reached on Conversion of...Conditional Agreement • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
AMENDMENT --------- RESTRUCTURING, SETTLEMENT AND MUTUAL RELEASE AGREEMENT This Amendment to the Restructuring, Settlement and Mutual Release Agreement (this "Agreement") is entered into as of November 24, 1998 by and among Microelectronic Packaging,...Restructuring, Settlement and Mutual Release Agreement • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Agreement No. 98-143 ------ Effective Date: 7/21/98 -------Immunity From Suit Agreement • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • Illinois
EXHIBIT 10.69 January 19, 1999 Mr. Bernard Gutmann SCG Group Controller Motorola, Inc. 5005 East Mc Dowell Road, MD C210 Phoenix, AZ 85008 RE: Conditional Agreement Reached on Conversion of Debt to Equity Dear Bernard: On Friday, January 15, 1999,...Conditional Agreement on Conversion of Debt to Equity • April 15th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
