SEPARATION AND CONSULTING AGREEMENTSeparation and Consulting Agreement • August 2nd, 2013 • Amkor Technology Inc • Semiconductors & related devices • California
Amendment to Kun-Mortgage AgreementMortgage Agreement • August 2nd, 2013 • Amkor Technology Inc • Semiconductors & related devices
Whereas the above mentioned parties entered into the Kun-Mortgage Agreement (the “Agreement”) dated July 2, 2012 on the properties described in the attachment and completed the following registrations of kun-mortgage submitted to the Registration Division of the Seoul Eastern District Court under the submission No. 39384 on July 4, 2012:
GuaranteeAmkor Technology Inc • August 2nd, 2013 • Semiconductors & related devices
Reference is made to a certain loan agreement (the “Loan Agreement”) dated April 29, 2013 and made between (1) Amkor Technology Korea, Inc., as borrower (the “Borrower”) and (2) the Korea Development Bank as lender (the “Lender”), pursuant to which the Lender has agreed to make available to the Borrower a transferable term loan facility in an aggregate principal amount of up to one hundred fifty million US Dollars (US$150,000,000.00) upon the terms and conditions set out therein.
LOAN AGREEMENTLoan Agreement • August 2nd, 2013 • Amkor Technology Inc • Semiconductors & related devices
AMKOR TECHNOLOGY KOREA, INC., a corporation (chusik hoesa) organized and existing under the laws of Republic of Korea (“Korea”), with its registered head office at 100, Amkor-ro, Buk-gu, Gwangju, Korea (the “Borrower”); and
AMENDMENT AGREEMENT TO KUN-MORTGAGE AGREEMENTAmkor Technology Inc • August 2nd, 2013 • Semiconductors & related devices
* Please enter the appropriate information in your own handwriting in the spaces within the thick rectangles provided.* This amendment agreement is not required to be registered and becomes effective upon a mutual agreement by and among parties.
