CREDIT AND GUARANTY AGREEMENT dated as of October 26, 2004 among SANMINA-SCI CORPORATION, CERTAIN SUBSIDIARIES OF SANMINA-SCI CORPORATION, as Guarantors, VARIOUS LENDERS, CITIBANK, N.A., as Initial Issuing Bank BANC OF AMERICA SECURITIES LLC, as...Credit and Guaranty Agreement • December 29th, 2004 • Sanmina-Sci Corp • Printed circuit boards • New York
This CREDIT AND GUARANTY AGREEMENT, dated as of October 26, 2004, is entered into by and among SANMINA-SCI CORPORATION, a Delaware corporation ("Company"), CERTAIN SUBSIDIARIES OF COMPANY, as Guarantors, the Lenders party hereto from time to time, CITIBANK, N.A., as the Initial Issuing Bank (the "Initial Issuing Banks" and, together with the Lenders, the "Lender Parties"), BANC OF AMERICA SECURITIES LLC ("BAS"), as Syndication Agent (the "Syndication Agent"), DEUTSCHE BANK TRUST COMPANY AMERICAS, MERRILL LYNCH, PIERCE, FENNER & SMITH INCORPORATED and THE BANK OF NOVA SCOTIA, as Co-Documentation Agents (the "Co-Documentation Agents"), CITIGROUP GLOBAL MARKETS INC. and BAS, as Joint Book Managers and Joint Lead Arrangers (the "Joint Lead Arrangers"), and CITICORP USA, INC. ("CUSA"), as Administrative Agent (together with its permitted successors in such capacity, "Administrative Agent"), and Citibank, N.A, as Collateral Agent (together with its permitted successors in such capacity, "Col
SEPARATION AGREEMENT AND RELEASESeparation Agreement • December 29th, 2004 • Sanmina-Sci Corp • Printed circuit boards • California
This Separation Agreement and Release (the "Agreement") is made by and between Sanmina-SCI, a California corporation (the "Company"), and Rick R. Ackel ("Employee") dated as of January 20, 2004.
