FRAMEWORK AGREEMENT between VIA OPTRONICS GMBH and TOPPAN PRINTING CO., LTD. dated November 30, 2017Framework Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Framework Agreement (this “Agreement”) is entered into on [November 30], 2017 between VIA optronics GmbH, a company organized under the laws of Germany (“VIA”), and Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”). Each of Toppan and VIA is referred to as a “Party”, and together, as the “Parties”.
EMPLOYEE SECONDMENT AGREEMENT (TEP)Employee Secondment Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Employee Secondment Agreement (TEP) (this “Agreement”) is entered into on March 29, 2018 by and between Toppan Electronics Products Co., Ltd. with its principal place of business at 5-1, Taito 1-chome, Taito-ku, Tokyo, Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products Co., Ltd.), with its principal place of business at 1101-20, Myohoji-cho, Higashiomi, Shiga, 527-0046, Japan (“COMPANY”). This Agreement is effective from March 26, 2018 (the “Effective Date”). Each of Toppan and COMPANY is referred to herein as a “Party” and are collectively referred to herein as the “Parties.”
SATTE FACILITY LEASE AGREEMENTSatte Facility Lease Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Satte Facility Lease Agreement (this “Agreement”) is entered into on March 29, 2018 between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Landlord”), and VTS-TOUCHSENSOR CO., LTD. (formerly known as Toppan Touch Panel Products Co., Ltd.), a company organized under the laws of Japan (“Tenant”). This Agreement is effective from March 26, 2018 (the “Effective Date”). Each of Landlord and Tenant is referred to as a “Party.”
INVESTMENT AGREEMENTInvestment Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryTHIS INVESTMENT AGREEMENT (this “Agreement”) is made as of March 7, 2019 by and between VIA optronics AG, a German stock corporation (Aktiengesellschaft), with business address at Sieboldstraße 18, 80411 Nuremberg, Germany (“VIA”), VIA Optronics GmbH, a German private limited company (Gesellschaft mit beschränkter Haftung), with business address at Lettenfeldstraße 15, 90592 Schwarzenbruck, Germany (“VIA GmbH”) and Corning Research & Development Corporation, a Delaware corporation, with business address at One Riverfront Plaza, Corning, New York 14831, USA (“Corning”).
SHIGA FACILITY LEASE AGREEMENTShiga Facility Lease Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Shiga Facility Lease Agreement (this “Agreement”) is entered into on March 29, 2018 between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Landlord”), and VTS-TOUCHSENSOR CO., LTD. (formerly known as Toppan Touch Panel Products Co., Ltd.), a company organized under the laws of Japan (“Tenant”). This Agreement is effective from March 26, 2018 (the “Effective Date”). Each of Landlord and Tenant is referred to as a “Party.”
CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY [***], HAS BEEN OMITTED BECAUSE IT IS NOT MATERIAL AND WOULD LIKELY CAUSE COMPETITIVE HARM TO THE COMPANY IF PUBLICLY DISCLOSED.Cooperation Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryDie Parteien haben einen Rahmenliefervertrag vom 17. Dezember 2010 und einen Ergänzungsvertrag zu diesem Rahmenliefervertrag am 19. April 2013 /26. April 2013 geschlossen (“Bisheriger Rahmenliefervertrag”). The Parties entered into a Framework Supply Agreement on December 17, 2010 and a supplementary agreement thereto dated April 19/26, 2013 (hereinafter referred to jointly as the “Current Framework Supply Agreement”).
CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY [***], HAS BEEN OMITTED BECAUSE IT IS NOT MATERIAL AND WOULD LIKELY CAUSE COMPETITIVE HARM TO THE COMPANY IF PUBLICLY DISCLOSED. TRANSFERRED IP PURCHASE AGREEMENTTransferred Ip Purchase Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Transferred IP Purchase Agreement (this “Agreement”) is entered into on March 29, 2018 between VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (“Buyer”), and Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Seller”). Each of Buyer and Seller is referred to as a “Party.”
EMPLOYEE SECONDMENT AGREEMENT (TOPPAN)Employee Secondment Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Employee Secondment Agreement (Toppan) (this “Agreement”) is entered into on March 29, 2018 by and between Toppan Printing Co., Ltd. with its principal place of business at 5-1, Taito 1-chome, Taito-ku, Tokyo, Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products Co., Ltd.), with its principal place of business at 1101-20, Myohoji-cho, Higashiomi, Shiga, 527-0046, Japan (“COMPANY”). This Agreement is effective from March 26, 2018 (the “Effective Date”). Each of Toppan and COMPANY is referred to herein as a “Party” and are collectively referred to herein as the “Parties.”
IP LICENSE AGREEMENTIp License Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis IP License Agreement (this “Agreement”) is entered into on March 29, 2018 (the “Effective Date”) between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Licensor”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (“Licensee”). Each of Licensor and Licensee is referred to as a “Party.”
SHAREHOLDERS’ AGREEMENT between VIA OPTRONICS GMBH and TOPPAN PRINTING CO., LTD. dated March 23, 2018Shareholders’ Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Shareholders’ Agreement (this “Agreement”) is entered into on March 23, 2018 between VIA optronics GmbH, a company organized under the laws of Germany (the “VIA”) and Toppan Printing Co., Ltd., a company organized under the laws of Japan (the “Toppan” and, together with VIA, the “Shareholders”)
BUSINESS ASSISTANCE AGREEMENTBusiness Assistance Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Business Assistance Agreement (the “Agreement”) is entered into on March 29, 2018, between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (the “Company”). This Agreement is effective from March 26, 2018 (the “Effective Date”). Each of Toppan and the Company is referred to as a “Party”, and together, as the “Parties”.
Service and Support AgreementService and Support Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Service and Support Agreement (“Agreement”) confirms in writing the already orally made agreement between the Parties as of March and is effective as of 7th day of January, 2019 (the “Effective Date”), between
Framework Development AgreementFramework Development Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Framework Development Agreement (“Agreement”) confirms in writing the already orally made agreement between the Parties as of April 2019 and is effective as of 1st day of November, 2018 (the “Effective Date”), between
R&D AND CONSIGNMENT AGREEMENTD and Consignment Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis R&D and Consignment Agreement (the “Agreement”) is entered into on March 29, 2018 between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (the “Company”). This Agreement is effective from and after March 29, 2018 (the “Effective Date”). Each of Toppan and the Company is referred to as a “Party”, and together, as the “Parties”.
ContractVia Optronics AG • September 4th, 2020 • Semiconductors & related devices
Company FiledSeptember 4th, 2020 IndustryCERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY [***], HAS BEEN OMITTED BECAUSE IT IS NOT MATERIAL AND WOULD LIKELY CAUSE COMPETITIVE HARM TO THE COMPANY IF PUBLICLY DISCLOSED.
DISTRIBUTION AGREEMENTDistribution Agreement • September 4th, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 4th, 2020 Company IndustryThis Distribution Agreement (this “Agreement”) is entered into on March 29, 2018 between VTS-Touchsensor Co., Ltd., a company organized under the laws of Japan (“Seller”), and Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Distributor”). Each of Seller and Distributor is referred to as a “Party.” This Agreement is effective March 29, 2018 (the “Effective Date”).