0001065246-09-000014 Sample Contracts

AGREEMENT AND PLAN OF MERGER Dated as of February 23, 2009, Among EXAR CORPORATION, HYBRID ACQUISITION CORP. And HI/FN, INC.

Merger Agreement • February 25th, 2009 • Hi/Fn Inc • Semiconductors & related devices • Delaware

• Contract Type
  Merger Agreement
• Filed
  February 25th, 2009
• Company
  Hi/Fn Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

AGREEMENT AND PLAN OF MERGER, dated as of February 23, 2009 (this “Agreement”), among EXAR CORPORATION, a Delaware corporation (“Parent”), HYBRID ACQUISITION CORP., a Delaware corporation and a wholly owned subsidiary of Parent (“Sub”), and HI/FN, INC., a Delaware corporation (the “Company”).

Contract

Tender and Voting Agreement • February 25th, 2009 • Hi/Fn Inc • Semiconductors & related devices • Delaware

• Contract Type
  Tender and Voting Agreement
• Filed
  February 25th, 2009
• Company
  Hi/Fn Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

TENDER AND VOTING AGREEMENT, dated as of February 23, 2009 (this “Agreement”), among Exar Corporation, a Delaware corporation (“Parent”), and the persons listed on Exhibit A hereto (each, a “Stockholder” and collectively, the “Stockholders”).1