0001104659-05-030123 Sample Contracts

AGREEMENT FOR WAFER PRODUCTION
Wafer Production Agreement • June 28th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • Hong Kong

This Agreement (“Agreement”) is entered into on June 22, 2005 by Advanced Power Technology, Inc.; a Delaware Corporation with headquarters located at 405 SW Columbia Street in Bend, Oregon, USA (hereinafter referred to as “APT”)

AutoNDA by SimpleDocs
Draft better contracts in just 5 minutes Get the weekly Law Insider newsletter packed with expert videos, webinars, ebooks, and more!