AGREEMENT FOR WAFER PRODUCTIONWafer Production Agreement • June 28th, 2005 • Advanced Power Technology Inc • Semiconductors & related devices • Hong Kong
This Agreement (“Agreement”) is entered into on June 22, 2005 by Advanced Power Technology, Inc.; a Delaware Corporation with headquarters located at 405 SW Columbia Street in Bend, Oregon, USA (hereinafter referred to as “APT”)
EXHIBIT 10.2 WAFER PRODUCTION AGREEMENT (FOR OPTIONEES ONLY)Wafer Production Agreement • November 21st, 1996 • Benchmarq Microelectronics Inc • Semiconductors & related devices • California
