ContractSupplemental Indenture • January 3rd, 2007 • Sanmina-Sci Corp • Printed circuit boards • New York
THIS SECOND SUPPLEMENTAL INDENTURE (this “Supplemental Indenture”), dated as of December 26, 2006, is entered into between Sanmina-SCI Corporation, a Delaware corporation (the “Company”), and U.S. Bank National Association, as trustee under the indenture referred to below (the “Trustee”).
AMENDMENT NO. 3 AND WAIVER TO AMENDED AND RESTATED CREDIT AND GUARANTY AGREEMENTCredit and Guaranty Agreement • January 3rd, 2007 • Sanmina-Sci Corp • Printed circuit boards • New York
This Amendment No. 3 and Waiver to Amended and Restated Credit and Guaranty Agreement (this “Amendment”), dated as of December 29, 2006, is made by Sanmina-SCI Corporation, a Delaware corporation (the “Company”), each of the subsidiaries of the Company listed on the signature pages hereto (the “Guarantors”), the Lenders party hereto, Citibank, N.A., as Collateral Agent (the “Collateral Agent”), and Bank of America, N.A., as Administrative Agent (the “Administrative Agent”).
ContractFirst Supplemental Indenture • January 3rd, 2007 • Sanmina-Sci Corp • Printed circuit boards • New York
THIS FIRST SUPPLEMENTAL INDENTURE (this “Supplemental Indenture”), dated as of December 26, 2006, is entered into between Sanmina-SCI Corporation, a Delaware corporation (the “Company”), and U.S. Bank National Association, as trustee under the indenture referred to below (the “Trustee”).
