PATENT LICENSE AGREEMENTPatent License Agreement • January 16th, 2007 • Micron Technology Inc • Semiconductors & related devices • Delaware
This agreement (this “Agreement”) is made this 15th day of September, 2006 (“Effective Date”) by and among Toshiba Corporation, a Japanese corporation duly organized and existing under the laws of Japan and having its principal place of business at 1 1, Shibaura l Chome, Minato Ku, Tokyo 105-8001, Japan (“Toshiba”), Acclaim Innovations, LLC, a limited liability corporation duly organized and existing under the laws of the state of Delaware, United States of America and having its principal place of business at 209 West Main Street, Boise, Idaho (“Acclaim”), and Micron Technology, Inc., a corporation organized and existing under the laws of Delaware, United States of America and having its principal place of business at 8000 S. Federal Way, Boise, Idaho (“Micron”).
SETTLEMENT AND RELEASE AGREEMENTSettlement and Release Agreement • January 16th, 2007 • Micron Technology Inc • Semiconductors & related devices • Delaware
This Settlement and Release Agreement (“Agreement”) is made as of September 15, 2006 (“Effective Date”) by and among Toshiba Corporation, a corporation organized under the laws of Japan, with its principal office at 1 1 Shibaura 1 chome, Minato-ku, Tokyo 105-8001, Japan (“Toshiba”), Micron Technology, Inc., a corporation organized under the laws of Delaware, with its principal place of business at 8000 S. Federal Way, Boise, Idaho (“Micron”), and Acclaim Innovations, LLC, a limited liability company, organized under the laws of Delaware with its principal place of business at 209 West Main Street, Boise, Idaho (“Acclaim”) (each a “Party” and collectively, the “Parties”).
