FOUNDRY MANUFACTURING AGREEMENTFoundry Manufacturing Agreement • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • California
THIS FOUNDRY MANUFACTURING AGREEMENT (the “Agreement”) is entered into on February 27, 2007 (the “Effective Date”) by and between OmniVision International Holding Ltd., a Cayman Islands company, having its registered office at Second Floor, Zephyr House, Mary Street, P. O. Box 709, George Town, Grand Cayman, Cayman Islands, British West Indies (“OmniVision”) and Powerchip Semiconductor Corp., a company duly incorporated under the laws of the Republic of China, having its principal office located at No. 12, Li-Hsin Rd. 1, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. (“PSC”). OmniVision and PSC are each a “Party” and collectively the “Parties”.
EQUITY INTERESTS TRANSFER AGREEMENT by and among CHINA WLCSP LIMITED and INFINITY-CSVC VENTURE CAPITAL ENTERPRISE and OMNIVISION TRADING (HONG KONG) COMPANY LIMITED APRIL, 6, 2007Equity Interests Transfer Agreement • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • New York
This Equity Interests Transfer Agreement (this “Agreement”) is made as of April 6, 2007 (the “Effective Date”), by and among the following entities:
DEED OF TRUST, ASSIGNMENT OF RENTS AND LEASES, SECURITY AGREEMENT AND FIXTURE FILINGConformed • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • California
THIS DEED OF TRUST, ASSIGNMENT OF RENTS AND LEASES, SECURITY AGREEMENT AND FIXTURE FILING (the “Deed of Trust”) is made as of March 20, 2007 by OMNIVISION TECHNOLOGIES, INC., a Delaware corporation (“Trustor”), as trustor, to FIRST AMERICAN TITLE INSURANCE COMPANY (“Trustee”), as trustee, for the benefit of CITIBANK, N.A., a national banking association (“Beneficiary”), as beneficiary.
LOAN AND SECURITY AGREEMENT by and between OMNIVISION TECHNOLOGIES, INC. a Delaware corporation and CITIBANK, N.A., a national banking association Dated as of March 16, 2007Loan and Security Agreement • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • California
THIS LOAN AND SECURITY AGREEMENT (“Agreement”) is entered into as of the above date between Citibank N.A., a national banking association (“Lender”), with offices at 201 West Lexington Drive, 6th Floor, Glendale, California 91203, and the borrower named above (“Borrower”), whose chief executive office is located at the above address (“Borrower’s Address”).
CHINA WLCSP LIMITED INVESTMENT AGREEMENT April 6, 2007Investment Agreement • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • New York
Each of these entities may be referred to hereafter as a “Party” and collectively as “Parties”. All dollars and dollar sign denominations referred to hereinafter shall mean US Dollars.
TRANSACTIONOmnivision Technologies Inc • June 29th, 2007 • Semiconductors & related devices
The purpose of this letter agreement (this ‘Confirmation’) is to set forth the terms and conditions of the Transaction entered into between OMNIVISION TECHNOLOGIES INC (‘Counterparty’) and Citibank N.A., New York (‘Citibank’) on the Trade Date specified below (the ‘Transaction’).
STOCK PLEDGE AGREEMENTStock Pledge Agreement • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • California
THIS STOCK PLEDGE AGREEMENT is entered into as of this 16th day of March, 2007, by OMNIVISION TECHNOLOGIES, INC., a Delaware corporation (“Pledgor”), as pledgor, in favor of CITIBANK N.A., a national banking association (“Secured Party”), as secured party.
