GUARANTEE AND COLLATERAL AGREEMENT made by MICRON TECHNOLOGY, INC. and certain of its Subsidiaries in favor of MORGAN STANLEY SENIOR FUNDING, INC., as Collateral Agent Dated as of April 26, 2016Guarantee and Collateral Agreement • April 26th, 2016 • Micron Technology Inc • Semiconductors & related devices • New York
GUARANTEE AND COLLATERAL AGREEMENT, dated as of April 26, 2016, made by MICRON TECHNOLOGY, INC. (the “Borrower”) and each of the signatories from time to time hereto (the “Guarantors”), in favor of MORGAN STANLEY SENIOR FUNDING, INC., as Collateral Agent (in such capacity, the “Collateral Agent”) for the banks and other financial institutions or entities (the “Lenders”) from time to time party to the Credit Agreement, dated as of April 26, 2016 (as amended, supplemented or otherwise modified from time to time, the “Credit Agreement”), among the Borrower, the Lenders, and Morgan Stanley Senior Funding, Inc., as the administrative agent (in such capacity, the “Administrative Agent”) and Collateral Agent.
SECURITY AGREEMENT made by MICRON TECHNOLOGY, INC. and certain of its Subsidiaries in favor of U.S. BANK NATIONAL ASSOCIATION, as Collateral Agent Dated as of April 26, 2016Security Agreement • April 26th, 2016 • Micron Technology Inc • Semiconductors & related devices • New York
SECURITY AGREEMENT, dated as of April 26, 2016, made by MICRON TECHNOLOGY, INC. (the “Company”) and each of the Non-Company Grantors (as defined below) from time to time hereto, in favor of U.S. BANK NATIONAL ASSOCIATION, as collateral agent (in such capacity, the “Collateral Agent”) for the holders of the Notes (the “Holders”) pursuant to the Indenture, dated as of April 26, 2016 (as amended, supplemented or otherwise modified from time to time, the “Indenture”), among the Company, the Non-Company Grantors, the Trustee and the Collateral Agent.
CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and MORGAN STANLEY SENIOR FUNDING, INC., as Administrative Agent and as Collateral Agent Dated as of April 26, 2016 MORGAN STANLEY SENIOR FUNDING, INC.,...Credit Agreement • April 26th, 2016 • Micron Technology Inc • Semiconductors & related devices • New York
THIS CREDIT AGREEMENT, dated as of April 26, 2016, among MICRON TECHNOLOGY, INC., a Delaware corporation (the “Borrower”), MORGAN STANLEY SENIOR FUNDING, INC. (“MSSF”), as administrative agent (in such capacity and including any successors in such capacity, the “Administrative Agent” or the “Agent”) and as collateral agent (in such capacity and including any successors in such capacity, the “Collateral Agent”), the other agents party hereto and each of the financial institutions from time to time party hereto (collectively, the “Lenders”).
INDENTURE Dated as of April 26, 2016 Among MICRON TECHNOLOGY, INC., THE GUARANTORS NAMED ON THE SIGNATURE PAGES HERETO and U.S. BANK NATIONAL ASSOCIATION, as Trustee and as Collateral Agent 7.500% SENIOR SECURED NOTES DUE 2023Indenture • April 26th, 2016 • Micron Technology Inc • Semiconductors & related devices • New York
INDENTURE, dated as of April 26, 2016 among Micron Technology, Inc., a Delaware corporation, the Guarantors named on the signature pages hereto and U.S. Bank National Association, a national banking association, as Trustee and as Collateral Agent.
