CONSULTING AGREEMENTConsulting Agreement • February 29th, 2008 • Diodes Inc /Del/ • Semiconductors & related devices • California
This Consulting Agreement (“Agreement”), which shall be effective as of July 31, 2007, by and between DIODES, INCORPORATED (“DIODES”), and MR. M.K. LU (“M.K.”), and each may be referred to as a party (“Party”), or both may be collectively known as parties (“Parties”), is made with reference to the following facts:
SUPPLEMENT TO LEASE AGREEMENT-LE0604Supplement to Lease Agreement • February 29th, 2008 • Diodes Inc /Del/ • Semiconductors & related devices
THIS SUPPLEMENT TO LEASE AGREEMENT is made and effective as of January 1st, 2007, by and between Shanghai Ding Hong Electronic Co., Ltd. (“Landlord”) and Shanghai Kai Hong Electronic Co., Ltd. (“Tenant”).
SUPPLEMENT TO LEASE AGREEMENT-LE0603Supplement to Lease Agreement • February 29th, 2008 • Diodes Inc /Del/ • Semiconductors & related devices
THIS SUPPLEMENT TO LEASE AGREEMENT is made and effective as of January 1st, 2007, by and between Shanghai Yuan Hao Electronic Co., Ltd. (“Landlord”) and Shanghai Kai Hong Technology Co., Ltd. (“Tenant”).
Supplementary Agreement to Lease Agreement dated on 28th June 2004 —— 0701-01Supplementary Agreement • February 29th, 2008 • Diodes Inc /Del/ • Semiconductors & related devices
This Supplementary Agreement (hereinafter referred to as "the Supplementary Agreement") is entered into on December 31, 2007, in the city of Shanghai, by and between Shanghai Kai Hong Technology Co., Ltd. (hereinafter referred to as "Party A") with its registered office at No.1, Lane 18, SanZhuang Road Songjiang Export Processing Zone Shanghai, China and Shanghai Yuan Hao Electronic Co., Ltd. (hereinafter referred to as "Party B") with its registered office at No.1, Lane 18, SanZhuang Road Songjiang Export Processing Zone, Shanghai, China.
PLATING PROCESSING AGREEMENTPlating Processing Agreement • February 29th, 2008 • Diodes Inc /Del/ • Semiconductors & related devices
This PLATING PROCESSING AGREEMENT (this "Agreement”) is made as of December 31, 2007, by and among Shanghai Ding Hong Electronic Co., Ltd. (Party A- the licensed subcontractor), with its registered address at No.999 Chenchun Road, Xinqiao Town, Songjiang, Shanghai, P.R.China; Shanghai Micro-Surface Co., Ltd. (Party B- the licensed subcontractor), with its registered address at No.1 Lane 18 San Zhuang Road, Songjiang Export Processing Zone, Shanghai, China; Shanghai Kai Hong Electronic Co., Ltd. (Party C- the customer), with its registered address No.999 Chenchun Road, Xinqiao Town, Songjiang, Shanghai, P.R.China; and Shanghai Kai Hong Technology Co., Ltd. (Party D- the customer), with its registered address at No.1 Lane 18 San Zhuang Road, Songjiang Export Processing Zone, Shanghai, China. Party A, Party B, Party C and Party D are collectively refer to as “all parties” hereinafter.
Lease Agreement - LE0701Lease Agreement - Le0701 • February 29th, 2008 • Diodes Inc /Del/ • Semiconductors & related devices
This Lease Agreement (hereinafter referred to as "the Lease") is entered into as of December 31, 2007 in the city of Shanghai, by and between SHANGHAI KAI HONG TECHNOLOGY CO., LTD. (hereinafter referred to as "Party A") with its registered office at No.1 Lane 18 San Zhuang Road, Songjiang Export Processing Zone, Shanghai, P.R.China and SHANGHAI DING HONG ELECTRONIC CO., LTD. (hereinafter referred to as "Party B") with its registered office at No.999 Chenchun Road, Xinqiao Town, Songjiang, Shanghai, P.R.China.
