AEROFLEX INCORPORATED AND EACH OF THE GUARANTORS PARTY HERETO 11.75% SENIOR NOTES DUE 2015Indenture • January 16th, 2009 • Aeroflex Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 16th, 2009 Company Industry Jurisdiction
AMENDMENT NO. 2 TO EMPLOYMENT AGREEMENTEmployment Agreement • January 16th, 2009 • Aeroflex Inc • Semiconductors & related devices
Contract Type FiledJanuary 16th, 2009 Company IndustryAMENDMENT NO. 2 TO THE EMPLOYMENT AGREEMENT (this “Amendment”) made as of the 31st day of December, 2008 by and between AEROFLEX INCORPORATED, a Delaware corporation (hereinafter the “Company”) and CHARLES BADLATO (hereinafter the “Employee” and together with the Company, the “Parties”).
AMENDMENT NO. 1 TO EMPLOYMENT AGREEMENTEmployment Agreement • January 16th, 2009 • Aeroflex Inc • Semiconductors & related devices
Contract Type FiledJanuary 16th, 2009 Company IndustryAMENDMENT NO. 1 TO THE EMPLOYMENT AGREEMENT (this “Amendment”) made as of the 31st day of December, 2008 by and between AEROFLEX INCORPORATED, a Delaware corporation (hereinafter the “Company”) and LEONARD BOROW (hereinafter “Borow” and together with the Company, the “Parties”)).
AMENDMENT NO. 3 TO EMPLOYMENT AGREEMENTEmployment Agreement • January 16th, 2009 • Aeroflex Inc • Semiconductors & related devices
Contract Type FiledJanuary 16th, 2009 Company IndustryAMENDMENT NO. 3 TO THE EMPLOYMENT AGREEMENT (this “Amendment”) made as of the 31st day of December, 2008 by and between AEROFLEX INCORPORATED, a Delaware corporation (hereinafter the “Company”) and JOHN ADAMOVICH, JR. (hereinafter the “Executive” and together with the Company, the “Parties”).
AMENDMENT NO. 1 TO EMPLOYMENT AGREEMENTEmployment Agreement • January 16th, 2009 • Aeroflex Inc • Semiconductors & related devices
Contract Type FiledJanuary 16th, 2009 Company IndustryAMENDMENT NO. 1 TO THE EMPLOYMENT AGREEMENT (this “Amendment”) made as of the 31st day of December, 2008 by and between AEROFLEX INCORPORATED, a Delaware corporation (hereinafter the “Company”) and JOHN BUYKO (hereinafter “Buyko” and together with the Company, the “Parties”).
AMENDMENT NO. 4 TO EMPLOYMENT AGREEMENTEmployment Agreement • January 16th, 2009 • Aeroflex Inc • Semiconductors & related devices
Contract Type FiledJanuary 16th, 2009 Company IndustryAMENDMENT NO. 4 TO THE EMPLOYMENT AGREEMENT (this “Amendment”) made as of the 31st day of December, 2008 by and between AEROFLEX INCORPORATED, a Delaware corporation (hereinafter the “Company”) and CARL CARUSO (hereinafter the “Executive” and together with the Company, the “Parties”).
AMENDMENT NO. 3 TO EMPLOYMENT AGREEMENTEmployment Agreement • January 16th, 2009 • Aeroflex Inc • Semiconductors & related devices
Contract Type FiledJanuary 16th, 2009 Company IndustryAMENDMENT NO. 3 TO EMPLOYMENT AGREEMENT (“Amendment No. 3”) made effectively as of the 24th day of December, 2008 by and between Aeroflex Incorporated, a Delaware corporation (together with its successors and assigns, the ACompany@), and Carl Caruso (hereinafter the AEmployee@).