BY AND AMONGMerger Agreement • May 29th, 2007 • Aeroflex Inc • Semiconductors & related devices • Delaware
AGREEMENT AND PLAN OF MERGERMerger Agreement • April 15th, 2002 • Aeroflex Inc • Semiconductors & related devices • Delaware
Exhibit 4.1 STOCK OPTION AGREEMENT AGREEMENT made the __ day of September, 2003 between AEROFLEX INCORPORATED, a Delaware corporation, (hereinafter called the "Company") and ___________ (hereinafter called the "Optionee"). W I T N E S S E T H: - - - -...Stock Option Agreement • September 8th, 2003 • Aeroflex Inc • Semiconductors & related devices
1 Exhibit 1.1 3,250,000 Shares Aeroflex Incorporated Shares of Common Stock UNDERWRITING AGREEMENTUnderwriting Agreement • April 12th, 2000 • Aeroflex Inc • Semiconductors & related devices • New York
EXHIBIT 10.1 EXECUTIVE EMPLOYMENT AGREEMENT THIS EXECUTIVE EMPLOYMENT AGREEMENT (the "Agreement") is entered into as of this 9th day of November, 2005 (the "Effective Date"), by and between Aeroflex Incorporated, a Delaware corporation (together with...Executive Employment Agreement • November 15th, 2005 • Aeroflex Inc • Semiconductors & related devices • New York
GUARANTEE AGREEMENTGuarantee Agreement • March 27th, 2006 • Aeroflex Inc • Semiconductors & related devices • New York
ANDStock Purchase Agreement • August 5th, 2003 • Aeroflex Inc • Semiconductors & related devices • New York
EMPLOYMENT AGREEMENT THIS EMPLOYMENT AGREEMENT, made and entered into as of February 5, 1997, between Aeroflex Incorporated, a Delaware corporation, with its principal office located at 35 South Service Road, Plainview, NY 11803 (together with its...Employment Agreement • May 22nd, 1997 • Aeroflex Inc • Semiconductors & related devices • New York
EMPLOYMENT AGREEMENT -------------------- AGREEMENT made effectively as of this 5th day of December, 2006, by and between AEROFLEX INCORPORATED, a Delaware corporation (hereinafter called the "Company"), and JOHN E. BUYKO residing at 28 Beaumont...Employment Agreement • December 7th, 2006 • Aeroflex Inc • Semiconductors & related devices • New York
EXHIBIT 4.1 FORM OF STOCK OPTION AGREEMENT ------------------------------ AGREEMENT made the 20th day of June, 2005 between AEROFLEX INCORPORATED, a Delaware corporation, (hereinafter called the "Company") and [NAME] (hereinafter called the...Stock Option Agreement • September 21st, 2005 • Aeroflex Inc • Semiconductors & related devices
Exhibit 4.2 STOCK OPTION AGREEMENT ---------------------- AGREEMENT made the 25th day of February, 1999, between Aeroflex Incorporated, a Delaware corporation, (hereinafter called the "Company") and _______, residing at _____________________...Stock Option Agreement • November 2nd, 1999 • Aeroflex Inc • Semiconductors & related devices
andRights Agreement • August 14th, 1998 • Aeroflex Inc • Semiconductors & related devices • Delaware
AMENDMENT NO. 5 TO EMPLOYMENT AGREEMENT AMENDMENT NO. 5 TO EMPLOYMENT AGREEMENT made as of the 17 day of August, 2005 by and between AEROFLEX INCORPORATED, a Delaware corporation (hereinafter the "Company") and MICHAL GORIN (hereinafter the...Employment Agreement • August 22nd, 2005 • Aeroflex Inc • Semiconductors & related devices
ARTICLE I PRINCIPAL TERMS OF MERGERMerger Agreement • July 2nd, 2003 • Aeroflex Inc • Semiconductors & related devices
Amendment No. 2 to Employment AgreementEmployment Agreement • September 30th, 2002 • Aeroflex Inc • Semiconductors & related devices
ANDAsset Purchase Agreement • August 5th, 2003 • Aeroflex Inc • Semiconductors & related devices • New York
SALE AND PURCHASE AGREEMENT for the entire issued share capital of UbiNetics Limited together with such parts of the SPG business as are conducted in India, Japan and Hong Kong ------------------------------------------------------------------------Sale and Purchase Agreement • May 27th, 2005 • Aeroflex Inc • Semiconductors & related devices
AGREEMENT AND PLAN OF MERGER among AEROFLEX INCORPORATED TESTCO ACQUISITION CORP. and IFR SYSTEMS, INC. Dated as of April 13, 2002Merger Agreement • April 19th, 2002 • Aeroflex Inc • Semiconductors & related devices • Delaware
Exhibit 10.20 TRUST UNDER DEFERRED COMPENSATION PLAN This Trust Agreement (the "Trust Agreement") is made this 22nd day of August, 2001, by and between Aeroflex Incorporated, a Delaware corporation (the "Company") and American Stock Transfer & Trust...Trust Agreement • September 28th, 2001 • Aeroflex Inc • Semiconductors & related devices • New York
Exhibit 4.2 STOCK OPTION AGREEMENT AGREEMENT made the __ day of September, 2003 between AEROFLEX INCORPORATED, a Delaware corporation, (hereinafter called the "Company") and __________ (hereinafter called the "Optionee"). W I T N E S S E T H: - - - -...Stock Option Agreement • September 8th, 2003 • Aeroflex Inc • Semiconductors & related devices
WARRANT TO PURCHASE COMMON STOCK OF ARX, INC.Warrant Agreement • November 1st, 1996 • Aeroflex Inc • Semiconductors & related devices • Delaware
AEROFLEX INCORPORATED AND EACH OF THE GUARANTORS PARTY HERETO 11.75% SENIOR NOTES DUE 2015Indenture • January 16th, 2009 • Aeroflex Inc • Semiconductors & related devices • New York
Amendment No. 1 to Employment AgreementEmployment Agreement • May 22nd, 1997 • Aeroflex Inc • Semiconductors & related devices
Amendment No. 1 to Employment AgreementEmployment Agreement • May 22nd, 1997 • Aeroflex Inc • Semiconductors & related devices
June 27, 2003 Aeroflex Incorporated and MCE Acquisition Corporation 35 South Service Road Plainview, New York 11803 Attn.: Michael Gorin, President MCE Technologies, Inc. 310 Dino Drive Ann Arbor, Michigan 48103 Attn: John L. Smucker, President Re:...Shareholder Voting Agreement • July 2nd, 2003 • Aeroflex Inc • Semiconductors & related devices • New York
Exhibit 4.3 STOCK OPTION AGREEMENT AGREEMENT made the 13th day of August 2003, between AEROFLEX INCORPORATED, a Delaware corporation, (hereinafter called the "Company") and _______________ (hereinafter called the "Optionee"). W I T N E S S E T H: - -...Stock Option Agreement • September 8th, 2003 • Aeroflex Inc • Semiconductors & related devices
FORM OF INDEMNIFICATION AGREEMENTIndemnification Agreement • February 9th, 2011 • Aeroflex Inc • Semiconductors & related devices • Delaware
This Indemnification Agreement ("Agreement") is made as of February ___, 2011 by and between Aeroflex Incorporated, a Delaware corporation (the "Company"), and ________________ ("Indemnitee").
AMENDMENT NO. 1 TO EMPLOYMENT AGREEMENT AMENDMENT NO. 1 TO EMPLOYMENT AGREEMENT, made and entered into as of March __ 2005, between Aeroflex Incorporated, a Delaware corporation, with its principal office located at 35 South Service Road, Plainview,...Employment Agreement • March 11th, 2005 • Aeroflex Inc • Semiconductors & related devices
AGREEMENT AND PLAN OF MERGER BY AND AMONG AX HOLDING CORP. (“Parent”), AX ACQUISITION CORP. a wholly-owned direct subsidiary of Parent (“Merger Sub”), and AEROFLEX INCORPORATED (the “Company”) Dated as of May 25, 2007Merger Agreement • June 5th, 2007 • Aeroflex Inc • Semiconductors & related devices • Delaware
AGREEMENT AND PLAN OF MERGER, dated as of May 25, 2007 (this “Agreement”), by and among AX Holding Corp., a Delaware corporation (“Parent”), AX Acquisition Corp., Inc., a Delaware corporation and a wholly-owned subsidiary of Parent (“Merger Sub”), and Aeroflex Incorporated, a Delaware corporation (the “Company”). Capitalized terms used without having been previously defined in this Agreement are defined in the Section indicated for such capitalized terms in the Index of Defined Terms.
COMMON STOCK PURCHASE AGREEMENT COMMON STOCK PURCHASE AGREEMENT made as of this 13th day of February 1996, by and among MIC TECHNOLOGY CORPORATION, a Texas corporation (the "Company"), AEROFLEX INCORPORATED, a Delaware corporation (the "Purchaser"),...Common Stock Purchase Agreement • March 25th, 1996 • Aeroflex Inc • Miscellaneous fabricated metal products • New York
Common Stock UNDERWRITING AGREEMENTUnderwriting Agreement • March 8th, 2004 • Aeroflex Inc • Semiconductors & related devices • New York
Exhibit 10.4 AMENDMENT NO. 1 TO EMPLOYMENT AGREEMENT AMENDMENT NO. 1 TO EMPLOYMENT AGREEMENT made effectively as of the 21st day of November, 2006 by and between AEROFLEX INCORPORATED., a Delaware corporation (hereinafter the "Company") and JOHN...Employment Agreement • November 22nd, 2006 • Aeroflex Inc • Semiconductors & related devices
CREDIT AND GUARANTY AGREEMENT dated as of August 15, 2007 among AX ACQUISITION CORP., as Borrower, AX HOLDING CORP., as a Guarantor CERTAIN SUBSIDIARIES OF AEROFLEX INCORPORATED, collectively, as Guarantors, VARIOUS LENDERS, and GOLDMAN SACHS CREDIT...Credit and Guaranty Agreement • December 11th, 2008 • Aeroflex Inc • Semiconductors & related devices • New York
This CREDIT AND GUARANTY AGREEMENT, dated as of August 15, 2007, is entered into by and among AX ACQUISITION CORP., a Delaware corporation (“AX Acquisition”), AX HOLDING CORP., a Delaware corporation (“Holdings”), CERTAIN SUBSIDIARIES OF BORROWER, as Guarantors, the Lenders party hereto from time to time, GOLDMAN SACHS CREDIT PARTNERS L.P. (“GSCP”), as Administrative Agent (together with its permitted successors in such capacity, “Administrative Agent”), as Collateral Agent (together with its permitted successor in such capacity, “Collateral Agent”), as Sole Lead Arranger, Sole Bookrunner and Syndication Agent (in such capacity, “Syndication Agent”).
MAYER BROWN ROWE & MAW LONDON CONTENTSDeed of Guarantee • May 27th, 2005 • Aeroflex Inc • Semiconductors & related devices
AMENDMENT NO. 1 TO EMPLOYMENT AGREEMENT This Amendment No. 1 (this "Amendment") to the Employment Agreement (the "Employment Agreement") dated as of March 1, 1999 by and between Michael Gorin (the "Executive") and Aeroflex Incorporated (the...Employment Agreement • September 28th, 2000 • Aeroflex Inc • Semiconductors & related devices
