0001145549-09-000754 Sample Contracts

Engrossed on the letterhead of Export-Import Bank Of The United States]
Ex-Im Bank Facility Agreement • May 7th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices • New York

Ex-Im Bank Facility Agreement dated as of December 23, 2004, among Chartered Semiconductor Manufacturing Ltd. (“Borrower”), JP Morgan Chase Bank, National Association (“Lender” and “Facility Agent”) and the Export-Import Bank of the United States (“Ex-Im Bank”), in the principal amount of $653,130,629 (“Credit Agreement”)

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IBM — CHARTERED CONFIDENTIAL - 1 - IBM — Chartered Participation Agreement
Participation Agreement • May 7th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices

REDACTED Confidential Treatment Requested The portions of this document marked by “XXXXX” have been omitted pursuant to a request for confidential treatment and have been filed separately with the Securities and Exchange Commission

JOINT DEVELOPMENT PROJECT AGREEMENT for
Joint Development Project Agreement • May 7th, 2009 • Chartered Semiconductor Manufacturing LTD • Semiconductors & related devices

This Joint Development Project Agreement for XXXXX Bulk-Industry Standard Semiconductor Process Technology (“Project Agreement”) is made effective as of January 1, 2009 (the “Effective Date”) by and between International Business Machines Corporation (“IBM”), incorporated under the laws of the State of New York, U.S.A. and having an office for the transaction of business at 2070 Route 52, Hopewell Junction, NY 12533, U.S.A, and all Participating Parties.

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