EXPORT-IMPORT BANK OF THE UNITED STATES WORKING CAPITAL GUARANTEE PROGRAM BORROWER AGREEMENTBorrower Agreement • February 3rd, 2012 • Advanced Photonix Inc • Semiconductors & related devices
Contract Type FiledFebruary 3rd, 2012 Company Industry
LOAN AND SECURITY AGREEMENT (EX-IM LOAN FACILITY)Loan and Security Agreement • February 3rd, 2012 • Advanced Photonix Inc • Semiconductors & related devices • California
Contract Type FiledFebruary 3rd, 2012 Company Industry JurisdictionTHIS LOAN AND SECURITY AGREEMENT (EX-IM LOAN FACILITY) (“EX-IM AGREEMENT”) dated as of January __, 2012 (the “Effective Date”), between SILICON VALLEY BANK (“Bank”), ADVANCED PHOTONIX, INC., and PICOMETRIX, LLC (individually, a “Borrower” and collectively, the “Borrowers”), provides the terms on which Bank will lend to Borrowers and Borrowers will repay Bank. The parties agree as follows:
LOAN AND SECURITY AGREEMENTLoan and Security Agreement • February 3rd, 2012 • Advanced Photonix Inc • Semiconductors & related devices
Contract Type FiledFebruary 3rd, 2012 Company IndustryTHIS LOAN AND SECURITY AGREEMENT (this “Agreement”) dated as of January __, 2012 (the “Effective Date”) between SILICON VALLEY BANK (“Bank”), ADVANCED PHOTONIX, INC. and PICOMETRIX, LLC (individually, a “Borrower” and collectively, the “Borrowers”), provides the terms on which Bank shall lend to Borrowers and Borrowers shall repay Bank. The parties agree as follows: