0001193125-04-092207 Sample Contracts

Certain confidential information contained in this document, marked by brackets, has been omitted and filed separately with the Securities and Exchange Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended.
Intellectual Property Agreement • May 20th, 2004 • Applied Micro Circuits Corp • Semiconductors & related devices

WHEREAS, SELLER and BUYER have executed concurrently herewith an “Asset Purchase Agreement” (“APA”), and other ancillary agreements identified herein as the “Operative Agreements” for the purpose of conveying certain assets and licensing certain intellectual property from SELLER to BUYER in a divestiture and acquisition transaction (the “Transaction”) associated with SELLER’s standard products development operations.

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Certain confidential information contained in this document, marked by brackets, has been omitted and filed separately with the Securities and Exchange Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended. Execution...
Patent License Agreement • May 20th, 2004 • Applied Micro Circuits Corp • Semiconductors & related devices

PATENT LICENSE AGREEMENT (“Agreement”) dated April 10, 2004 (“Agreement Date”) between INTERNATIONAL BUSINESS MACHINES CORPORATION, a New York corporation (“IBM”), and APPLIED MICROCIRCUITS CORPORATION (“LICENSEE”).

AMENDMENT NO. 1 TO ASSET PURCHASE AGREEMENT
Asset Purchase Agreement • May 20th, 2004 • Applied Micro Circuits Corp • Semiconductors & related devices

This AMENDMENT NO. 1 (the “Amendment”) to the existing Asset Purchase Agreement dated April , 2004 is made and entered into as of May 5, 2004 by and between International Business Machines Corporation, a New York corporation (“Seller”) and Applied Micro Circuits Corporation, a Delaware corporation (“Buyer”).

CoreConnectTM BUS LICENSE AGREEMENT between INTERNATIONAL BUSINESS MACHINES CORPORATION and APPLIED MICRO CIRCUITS CORPORATION
License Agreement • May 20th, 2004 • Applied Micro Circuits Corp • Semiconductors & related devices

This CoreConnect Bus License Agreement is made and entered into as of the Effective Date, by and between International Business Machines Corporation (“IBM”) and Applied Micro Circuits Corporation (“LICENSEE”).

Certain confidential information contained in this document, marked by brackets, has been omitted and filed separately with the Securities and Exchange Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended. EXECUTION...
Applied Micro Circuits Corp • May 20th, 2004 • Semiconductors & related devices

AMENDMENT dated May 5, 2004 to the POWER PC License Agreement dated as of the Closing Date, (hereinafter called the “PPCLA”) between INTERNATIONAL BUSINESS MACHINES CORPORATION, a New York corporation (hereinafter called “SELLER”), and APPLIED MICRO CIRCUITS CORPORATION, a corporation of Delaware (hereinafter called “BUYER”)

POWER PC LICENSE AGREEMENT between INTERNATIONAL BUSINESS MACHINES CORPORATION (AS SELLER) and APPLIED MICRO CIRCUITS CORPORATION (AS BUYER)
Power Pc License Agreement • May 20th, 2004 • Applied Micro Circuits Corp • Semiconductors & related devices

This POWER PC License Agreement is made and entered into as of the Effective Date, by and between International Business Machines Corporation, incorporated under the laws of the State of New York (“SELLER”), and Applied Micro Circuits Corporation, incorporated under the laws of Delaware (“BUYER”). BUYER and SELLER are hereinafter jointly referred to as the “Parties” or individually as a “Party”.

First Amended and Restated ASIC Attachment No. 5 To Custom Sales Agreement No. 001006
Applied Micro Circuits Corp • May 20th, 2004 • Semiconductors & related devices

When signed by the parties where provided below, this First Amended and Restated Attachment shall be incorporated into Custom Sales Agreement No. 001006 as First amended and Restated Attachment No. 5 effective on the Closing Date as defined in the Asset Purchase Agreement (“APA”). This First Amended and Restated No. 5 shall replace Attachment No. 5 in its entirety. Attachments are governed by the terms and conditions of the Base Agreement. Contemporaneously with the execution of this Attachment, Customer and IBM or its subsidiaries are executing an APA, an Intellectual Property Agreement (“IPA”), a Design Kit License Agreement (“DKLA”), a Patent License Agreement (“PLA”), a PowerPC License Agreement (“PPCLA”) and a Core Connect Bus License Agreement (“CCLA”) and ancillary documents, (collectively, the “Operative Agreements”). Upon consummation of the transactions contemplated under the Operative Agreements, IBM will, among other things, assign or license to Customer certain technology

ASSET PURCHASE AGREEMENT between Applied Micro Circuits Corporation (as “Buyer”), and International Business Machines Corporation, (as “Seller”) Dated: April , 2004
Asset Purchase Agreement • May 20th, 2004 • Applied Micro Circuits Corp • Semiconductors & related devices

THIS ASSET PURCHASE AGREEMENT (the “Agreement”), executed and dated as of April , 2004, by and between Applied Micro Circuits Corporation, a Delaware corporation (“Buyer”), and International Business Machines Corporation, a New York corporation (“Seller” or “IBM”).

Contract
Applied Micro Circuits Corp • May 20th, 2004 • Semiconductors & related devices

Certain confidential information contained in this document, marked by brackets, has been omitted and filed separately with the Securities and Exchange Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended.

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