SEPARATION AND RELEASE OF CLAIMS AGREEMENTSeparation And • May 9th, 2005 • Applied Micro Circuits Corp • Semiconductors & related devices • Massachusetts
Contract Type FiledMay 9th, 2005 Company Industry JurisdictionThis Separation and Release of Claims Agreement (“Agreement”) is entered into by and between Ramakrishna Sudireddy (“Executive”) and Applied Micro Circuits Corporation (“AMCC” or “Company”). This Agreement will not be effective until the date upon which the revocation period specified in Section 6(d) hereof has expired (the “Effective Date”).