RELEASE OF CLAIMS AGREEMENTRelease of Claims Agreement • June 24th, 2005 • Applied Micro Circuits Corp • Semiconductors & related devices • California
Contract Type FiledJune 24th, 2005 Company Industry JurisdictionThis Release of Claims Agreement (“Agreement”) is entered into by and between Thomas L. Tullie (“Executive”) and Applied Micro Circuits Corporation (“AMCC” or “Company”). This Agreement will not be effective until the date upon which the revocation period specified in Section 6(d) hereof has expired (the “Effective Date”).