SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION INDEMNIFICATION AGREEMENTIndemnification Agreement • June 28th, 2005 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • New York
This Indemnification Agreement (“Agreement”) is entered into on the day of , 2005 by and between Semiconductor Manufacturing International Corporation, a Cayman Islands company (the “Company”), and (“Indemnitee”) and is deemed to be effective as of the 6th day of May, 2005.
SETTLEMENT AGREEMENTSettlement Agreement • June 28th, 2005 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • California
This Agreement (the “Agreement”) is entered into this 30th day of January 2005 by and among TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., a Taiwanese corporation, having a place of business located at No. 8 Li-Hsin Road 6, Hsin-Chu Science Park, Hsinchu, Taiwan, Republic of China and WaferTech, LLC, a limited liability company organized and existing under the laws of Delaware, having a principal place of business at 5509 N.W. Parker Street, Camas, Washington 98608, (collectively, “TSMC”) on behalf of themselves and all of their SUBSIDIARIES on the one hand; and SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION, a Cayman Island Corporation, having a place of business located at No. 18, Zhang Jiang Road, Pudong New Area, Shanghai 201203, People’s Republic of China on behalf of itself and all of its SUBSIDIARIES (collectively, “SMIC”).
