SETTLEMENT AGREEMENTSettlement Agreement • July 19th, 2005 • Semtech Corp • Semiconductors & related devices • California
This Settlement Agreement and Mutual Release (“Agreement”) is made by and among Semtech Corporation (“Semtech”) on the one hand, and the Royal Indemnity Company as successor to the Royal Insurance Company of America (hereinafter collectively referred to as “Royal”) on the other hand. Semtech and Royal shall be referred to herein individually as a “Party” and collectively as the “Parties.” The “Effective Date” of this Agreement is July 14, 2005.
LETTER AGREEMENTLetter Agreement • July 19th, 2005 • Semtech Corp • Semiconductors & related devices
In consideration of the execution by both parties of the Settlement Agreement and Release between Semtech and Royal signed simultaneously with this letter agreement (the “Settlement Agreement”), and notwithstanding Section 7.2 of the Settlement Agreement, in consideration of the mutual promises, covenants, obligations, agreements, and other undertakings set forth in the Settlement Agreement), and for other good and valuable consideration, the receipt and sufficiency of which is hereby acknowledged, the Parties agree by and among themselves, each with the other, as follows in this letter agreement (the “Letter Agreement”).
