AMENDED AND RESTATED UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENTUncommitted Revolving Credit Facility Agreement • May 9th, 2006 • Spansion Inc. • Semiconductors & related devices • Tokyo
This AMENDED AND RESTATED UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of March 31, 2006 (the “Amendment and Restatement Date”) is made by and between Spansion Japan Limited (the “Borrower”) and The Bank of Tokyo-Mitsubishi UFJ, Ltd. (the “Lender”).
AMENDMENT NO. 1 TO CREDIT AGREEMENTCredit Agreement • May 9th, 2006 • Spansion Inc. • Semiconductors & related devices • California
This Amendment No. 1 to Credit Agreement (this “Amendment”), dated as of April 7, 2006, amends that certain Credit Agreement, dated as of September 19, 2005 (as amended, the “Agreement”), among the financial institutions from time to time parties thereto (such financial institutions, together with their respective successors and assigns, are referred to hereinafter each individually as a “Lender” and collectively as the “Lenders”), Bank of America, N.A., with an office at 55 South Lake Avenue, Suite 900, Pasadena, California 91101, as administrative agent for the Lenders (in its capacity as agent, the “Agent”) and Spansion LLC, a Delaware limited liability company (“Borrower”). Capitalized terms used and not otherwise defined herein shall have the meanings ascribed to such terms in the Agreement.
CONTINUING GUARANTYContinuing Guaranty • May 9th, 2006 • Spansion Inc. • Semiconductors & related devices • California
This CONTINUING GUARANTY, is effective as of December 21, 2005, was executed on April 21, 2006, and is made by SPANSION INC., a Delaware corporation (“Guarantor”), in favor of BANK OF AMERICA, N.A., as agent (“Agent”) for the Lenders, in light of the following:
JOINDER AGREEMENTJoinder Agreement • May 9th, 2006 • Spansion Inc. • Semiconductors & related devices • California
This Joinder Agreement (this “Agreement”) is effective as of December 21, 2005, was executed on April 21, 2006, and is entered into by and among SPANSION INC. a Delaware corporation (the “Parent”), and BANK OF AMERICA, N.A., as agent (the “Agent”) for the financial institutions from time to time party to that certain Credit Agreement, dated as of September 19, 2005 (as amended to date, the “Credit Agreement”), by and among Spansion LLC, a Delaware limited liability company (“Borrower”), the financial institutions from time to time party thereto (the “Lenders”), and Agent. Capitalized terms not otherwise defined herein are defined in the Credit Agreement.
