U.S. $2,000,000,000 BRIDGE LOAN AGREEMENT Dated as of May 25, 2011 Among APPLIED MATERIALS, INC. as Borrower THE INITIAL LENDERS NAMED HEREIN as Initial Lenders and JPMORGAN CHASE BANK, N.A., as Administrative Agent MORGAN STANLEY SENIOR FUNDING, INC....Bridge Loan Agreement • May 31st, 2011 • Applied Materials Inc /De • Semiconductors & related devices • New York
BRIDGE LOAN AGREEMENT dated as of May 25, 2011 among APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders (the “Initial Lenders”) listed on the signature pages hereof, and JPMORGAN CHASE BANK, N.A. (“JPMCB”), as Administrative Agent.
U.S. $1,500,000,000 CREDIT AGREEMENT Dated as of May 25, 2011 Among APPLIED MATERIALS, INC. as Borrower THE INITIAL LENDERS NAMED HEREIN as Initial Lenders and JPMORGAN CHASE BANK, N.A., as Administrative Agent MORGAN STANLEY SENIOR FUNDING, INC....Credit Agreement • May 31st, 2011 • Applied Materials Inc /De • Semiconductors & related devices • New York
CREDIT AGREEMENT dated as of May 25, 2011 among APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders (the “Initial Lenders”) listed on the signature pages hereof, and JPMORGAN CHASE BANK, N.A. (“JPMCB”), as Administrative Agent.
