APPLIED MATERIALS, INC. as Issuer AND U.S. BANK NATIONAL ASSOCIATION as Trustee INDENTURE Dated as of June 8, 2011 UNSUBORDINATED DEBT SECURITIESIndenture • June 10th, 2011 • Applied Materials Inc /De • Semiconductors & related devices • New York
THIS INDENTURE is dated as of June 8, 2011 among APPLIED MATERIALS, INC., a Delaware corporation (the “Company”) and U.S. BANK NATIONAL ASSOCIATION (the “Trustee”).
APPLIED MATERIALS, INC. as Issuer AND U.S. Bank National Association, as Trustee FIRST SUPPLEMENTAL INDENTURE Dated as of June 8, 2011 $400,000,000 of 2.650% Senior Notes due 2016, $750,000,000 of 4.300% Senior Notes due 2021, and $600,000,000 of...First Supplemental Indenture • June 10th, 2011 • Applied Materials Inc /De • Semiconductors & related devices • New York
This security is one of a duly authorized series of debt securities of Applied Materials, Inc., a Delaware corporation (the “Company”), issued or to be issued in one or more series under and pursuant to an Indenture for the Company’s unsubordinated debt securities, dated as of June 8, 2011 (the “Base Indenture”), duly executed and delivered by and among the Company and U.S. Bank National Association (the “Trustee”), as supplemented by the First Supplemental Indenture, dated as of June 8, 2011 (the “First Supplemental Indenture”), by and between the Company and the Trustee. The Base Indenture as supplemented and amended by the First Supplemental Indenture is referred to herein as the “Indenture.” By the terms of the Base Indenture, the debt securities issuable thereunder are issuable in series that may vary as to amount, date of maturity, rate of interest and in other respects as provided in the Base Indenture. This security is one of the series designated on the face hereof (individual
