ContractMaximum Guarantee Agreement • April 25th, 2012 • BCD Semiconductor Manufacturing LTD • Semiconductors & related devices
Summary English Translation of Maximum Guarantee Agreement dated November 30, 2011 by and between BCD (Shanghai) Micro-Electronics Ltd. and Agricultural Bank of China Shanghai Xuhui Subbranch
Summary English Translation of Maximum Mortgage Agreement dated September 27, 2011 by and between BCD (Shanghai) Micro-Electronics Ltd. and Nanjing Bank Shanghai Branch Parties: Bank of Nanjing Shanghai Branch (the “Bank”) and BCD (Shanghai)...Maximum Mortgage Agreement • April 25th, 2012 • BCD Semiconductor Manufacturing LTD • Semiconductors & related devices
In order to secure the fulfillment by Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. (“SIM-BCD”) of its obligations under the Maximum Credit Line Agreement (“Principal Agreement”), BCD Shanghai ME agrees to pledge certain real property held by it as guaranty.
ContractInvestment Agreement • April 25th, 2012 • BCD Semiconductor Manufacturing LTD • Semiconductors & related devices
Summary English Translation of Amendment dated December 13, 2011, to Investment Agreement dated August 2, 2010, by and among Shanghai Zizhu Science-based Park Development Co., Ltd., BCD (Shanghai) Semiconductor Manufacturing Limited and BCD (Shanghai) Micro-Electronics Ltd.
Summary English Translation of Maximum Credit Line Agreement dated September 26, 2011 and entered into on September 27, 2011 by and between Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. and Bank of Nanjing Shanghai Branch Parties: Bank of...Maximum Credit Line Agreement • April 25th, 2012 • BCD Semiconductor Manufacturing LTD • Semiconductors & related devices • Shanghai
• Any credit facility which is fully secured, fully and irrevocably guaranteed by a financial institution accepted by the Bank, fully insured or fully guaranteed by any other risk-eliminating methods shall not be counted towards the maximum credit line.
Summary English Translation of Investment and Cooperation Agreement dated August 22, 2011 by and between Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. and Shanghai SIMAT Microelectronics Technology Co., Ltd. Party A: Shanghai SIM-BCD...Investment and Cooperation Agreement • April 25th, 2012 • BCD Semiconductor Manufacturing LTD • Semiconductors & related devices
This Agreement (“Agreement”) is entered into on August 22, 2011 by and between Party A and Party B with respect to Party A’s investment in Party B and the cooperation on the TDIP-8 project between both parties in accordance with the relevant provisions in the TDIP-8 Cooperation Agreement between the parties dated on July 8, 2011.
ContractMaximum Guarantee Agreement • April 25th, 2012 • BCD Semiconductor Manufacturing LTD • Semiconductors & related devices
Summary English Translation of Maximum Guarantee Agreement dated April 20, 2011 by and between BCD (Shanghai) Micro-Electronics Ltd. and China CITIC Bank Shanghai Branch
