Standard Contracts
Summary English Translation of Maximum Credit Line Agreement dated September 26, 2011 and entered into on September 27, 2011 by and between Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. and Bank of Nanjing Shanghai Branch Parties: Bank of...Maximum Credit Line Agreement • April 25th, 2012 • BCD Semiconductor Manufacturing LTD • Semiconductors & related devices • Shanghai
• Any credit facility which is fully secured, fully and irrevocably guaranteed by a financial institution accepted by the Bank, fully insured or fully guaranteed by any other risk-eliminating methods shall not be counted towards the maximum credit line.
Summary English Translation of Maximum Credit Line Agreement dated August 2, 2010 Parties: Bank of Nanjing Shanghai Branch (the “Bank”) and Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. (“SIM-BCD”) Date: August 2, 2010 Purpose: The Bank...Maximum Credit Line Agreement • January 5th, 2011 • BCD Semiconductor Manufacturing LTD • Semiconductors & related devices • Shanghai
• Any credit facility which is fully secured, fully and irrevocably guaranteed by a financial institution accepted by the Bank, fully insured or fully guaranteed by any other risk-eliminating methods shall not be counted towards the maximum credit line.
