LOAN AGREEMENT USD 150,000,000 AMKOR TECHNOLOGY KOREA, INC. - Borrower - THE KOREA DEVELOPMENT BANK - Lender - June 28, 2012Loan Agreement • July 2nd, 2012 • Amkor Technology Inc • Semiconductors & related devices
AMKOR TECHNOLOGY KOREA, INC., a corporation (chusik hoesa) organized and existing under the laws of Republic of Korea (“Korea”), with its registered head office at 100, Amkor-ro, Buk-gu, Gwangju, Korea (the “Borrower”); and
AMKOR TECHNOLOGY, INC., as Borrower SECOND AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT dated as of June 28, 2012 CERTAIN FINANCIAL INSTITUTIONS, as Lenders, BANK OF AMERICA, N.A., as Agent, and WELLS FARGO BANK, N.A., as Documentation Agent BANK...Loan and Security Agreement • July 2nd, 2012 • Amkor Technology Inc • Semiconductors & related devices • Texas
THIS SECOND AMENDED AND RESTATED LOAN AND SECURITY AGREEMENT, dated as of June 28, 2012 (the “Closing Date”), is among AMKOR TECHNOLOGY, INC., any of its Subsidiaries, if any, that become a party hereto as a Borrower after the Closing Date, the lending institutions party to this Agreement from time to time as lenders (collectively, the “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as administrative agent for the Lenders (the “Agent”).
KUN-MORTGAGE AGREEMENTKun-Mortgage Agreement • July 2nd, 2012 • Amkor Technology Inc • Semiconductors & related devices
