0001193125-12-481036 Sample Contracts

Amendment to Kun-Mortgage Agreement (Increase of Maximum Credit Amount)
Kun-Mortgage Agreement • November 27th, 2012 • Amkor Technology Inc • Semiconductors & related devices

Whereas the above mentioned parties entered into the Kun-Mortgage Agreement (the “Agreement”) dated July 2, 2012 on the properties described in the attachment and completed the following registrations of kun-mortgage submitted to the Registration Division of the Seoul Eastern District Court under the submission No. 39384 on July 4, 2012:

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LOAN AGREEMENT USD 100,000,000 AMKOR TECHNOLOGY KOREA, INC. - Borrower - THE KOREA DEVELOPMENT BANK - Lender - November 23, 2012
Loan Agreement • November 27th, 2012 • Amkor Technology Inc • Semiconductors & related devices

AMKOR TECHNOLOGY KOREA, INC., a corporation (chusik hoesa) organized and existing under the laws of Republic of Korea (“Korea”), with its registered head office at 100, Amkor-ro, Buk-gu, Gwangju, Korea (the “Borrower”); and

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