EXPLANATORY NOTE TO THIS EXHIBITBusiness Combination Agreement • September 24th, 2013 • Applied Materials Inc /De • Semiconductors & related devices • Delaware
Contract Type FiledSeptember 24th, 2013 Company Industry JurisdictionTHIS BUSINESS COMBINATION AGREEMENT (this “Agreement”) is made and entered into as of September 24, 2013, by and between: APPLIED MATERIALS, INC., a Delaware corporation (“Applied”); and TOKYO ELECTRON LIMITED, a Japanese corporation (kabushiki kaisha) (“TEL” and, collectively with Applied and each other Person who becomes a Party to this Agreement, the “Parties”). Capitalized terms used in this Agreement are defined in Exhibit A.