0001193125-14-450618 Sample Contracts

AMENDMENT NO. 2 AND WAIVER TO CREDIT AGREEMENT

Credit Agreement • December 22nd, 2014 • Applied Materials Inc /De • Semiconductors & related devices • New York

• Contract Type
  Credit Agreement
• Filed
  December 22nd, 2014
• Company
  Applied Materials Inc /De
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

AMENDMENT NO. 2 AND WAIVER TO CREDIT AGREEMENT (this “Agreement”), dated as of December 19, 2014, to that certain Credit Agreement, dated as of May 25, 2011 (as amended prior to the date hereof, the “Credit Agreement”), among Applied Materials, Inc. (the “Borrower”), the lenders that are parties thereto (the “Lenders”), and JPMorgan Chase Bank, N.A., as Administrative Agent for the Lenders.