FACILITY AGREEMENT DATED 22 May 2015 US$150,000,000 ASSET BACKED LOAN FACILITY FOR TTM TECHNOLOGIES ENTERPRISES (HK) LIMITED as Borrower arranged by THE HONGKONG AND SHANGHAI BANKING CORPORATION LIMITED as Arranger with THE HONGKONG AND SHANGHAI...Facility Agreement • May 29th, 2015 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Pursuant to Clause 20.4 (Collateral Report) of the Facility Agreement dated [ ] among, inter alia, TTM Technologies Enterprises (HK) Limited as the Borrower and The HongKong and Shanghai Banking Corporation Limited as the Arranger, Original Lender, Issuing Bank, Facility Agent and Security Trustee, I certify that all information furnished in this Collateral Report is true, accurate and complete.
