GUARANTY RELATING TO SECURED REVOLVING CREDIT AGREEMENTGuaranty • December 7th, 2015 • Freescale Semiconductor, Ltd. • Semiconductors & related devices • New York
GUARANTY (this “Guaranty”) dated as of December 7, 2015, made among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP Funding LLC and each of the subsidiaries of the Company listed on the signature pages hereto (each such subsidiary individually, a “Subsidiary Guarantor” and, collectively with any Person that becomes a “Guarantor” pursuant to Section 20, the “Subsidiary Guarantors”; the Company, NXP Funding LLC and the Subsidiary Guarantors are referred to collectively as the “Guarantors”) and Morgan Stanley Senior Funding, Inc., as the collateral agent (in such capacity, the “Collateral Agent”) and as Administrative Agent (in such capacity, the “Administrative Agent”) in each case, for the lenders (the “Lenders”) and issuers of letters of credit (the “Letter of Credit Issuers”) from time to time party to the Secured Revolving Credit Agreement (the “Credit Agreement”) dated as of December 7, 2015, between the Company, NXP Funding LLC (the “Co-Borrower”
ContractGuaranty • December 7th, 2015 • Freescale Semiconductor, Ltd. • Semiconductors & related devices
SUPPLEMENT NO. 2 dated as of December 7, 2015 to the GUARANTY (the “Guaranty”) dated as of March 4, 2011 (as amended and restated, supplemented or modified from time to time), among NXP B.V. (the “Company”, each of the GUARANTORS referred to therein, Barclays Bank PLC, as Administrative Agent (in such capacity, the “Administrative Agent”) and MORGAN STANLEY SENIOR FUNDING, INC. as Global Collateral Agent (in such capacity, the “Global Collateral Agent”) and MIZUHO CORPORATE BANK, LTD. (as “Taiwan Collateral Agent”), in each case, for the lenders (the “Lenders”) from time to time parties to the Credit Agreement referred to below.
