Translation, for reference only) Equity Interest Transfer AgreementEquity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
TRANSLATION FOR REFERENCE ONLY] NT$13,200,000,000 Syndicated Loan Agreement ChipMOS TECHNOLOGIES INC. (as Borrower) Land Bank of Taiwan Co., Ltd. Bank of Taiwan Co., Ltd. Taiwan Cooperative Bank Co., Ltd. (as Lead Arrangers and Lenders) Taishin...Syndicated Loan Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
To repay the existing loans from the financial institutions (including, but not limited to, the outstanding amount under the 2014 Syndicated Loan (as defined hereunder)) and to replenish the working capital, the Borrower requests the Lead Arranger to organize the Lenders and applies for a credit facility in the amount of NT$13.2 billion (NT$13,200,000,000) (hereinafter this “Syndicated Loan”).
Translation, for reference only) Equity Interest Transfer AgreementEquity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
Translation, for reference only) Termination AgreementTermination Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
THIS TERMINATION AGREEMENT (“Agreement”) is made and entered into as of November 30, 2016 (“Execution Date”), by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS Taiwan”), and Tibet MaoYeChaungXin INVESTMENT CO., LIMITED., a company incorporated under the laws of the People’s Republic of China (“Subscriber”).
Translation, for reference only) Termination AgreementTermination Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
THIS TERMINATION AGREEMENT (“Agreement”) is made and entered into as of November 30, 2016 (“Execution Date”), by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of Taiwan (“ChipMOS Taiwan”), and Tsinghua Unigroup Ltd., a company incorporated under the laws of the People’s Republic of China (“Tsinghua Unigroup”).
Proprietary & Strictly Confidential) ChipMOS TECHNOLOGIES (Shanghai) LTD. AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
THIS “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” (this “Agreement”) is entered into as of this 30th day of November, 2016 in Beijing by and among:
Privileged and Strictly Confidential) ChipMOS TECHNOLOGIES (SHANGHAI) LTD. EQUITY INTEREST TRANSFER AGREEMENT ChipMOS TECHNOLOGIES (BVI) LTD. (as Transferor) AND TIBET UNIGROUP GUOWEI INVESTMENT CO LTD. (as Transferee) AND ChipMOS TECHNOLOGIES INC.Equity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
Equity Interest Transfer AgreementEquity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
Translation, for reference only) Equity Interest Transfer AgreementEquity Interest Transfer Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
