Proprietary & Strictly Confidential) UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD. AMENDED AND RESTATED AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 11th, 2024 • Chipmos Technologies Inc • Semiconductors & related devices
Unimos Microelectronics (Shanghai) Co., Ltd. The 5th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 25th, 2019 • Chipmos Technologies Inc • Semiconductors & related devices
WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017, August 1, 2018 and December 29, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”);
ChipMOS TECHNOLOGIES (Shanghai) LTD. The 2nd Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 25th, 2019 • Chipmos Technologies Inc • Semiconductors & related devices
WHEREAS, Tibet Unigroup GuoWei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Gongqingcheng Changhou Investment Management Ltd., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W.Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) (“Hong Xin Capital”) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016 and April 10, 2017 for the matter of the joint venture of ChipMOS TECHNOLOGIES (Shanghai) LTD. (“ChipMOS Shanghai” or the “Company”);
Unimos Microelectronics (Shanghai) Co., Ltd. The 4th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 25th, 2019 • Chipmos Technologies Inc • Semiconductors & related devices
WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017, and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”);
The 7th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 23rd, 2020 • Chipmos Technologies Inc • Semiconductors & related devices
WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd. ("Investor A"), ChipMOS TECHNOLOGIES (BVI) LTD. ("Investor B"), Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) (the parties hereunder other than Investor A and Investor B shall be referred to as "Investor C" individually or collectively) made and executed the "AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE" and the 1st, 2nd, and 3rd supplemental agreements thereof (hereinafter collectively referred to as "JV Agreement") respectively on November 30, 2016, April 10, 2017, November 28, 2017 and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. ("Unimos Shanghai" or the "Company"). Furthermore, as the shareholder of Investor A, Beijing Unis Memory Technology Co., Ltd. made and executed the
Proprietary & Strictly Confidential) ChipMOS TECHNOLOGIES (Shanghai) LTD. AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 20th, 2017 • Chipmos Technologies Inc • Semiconductors & related devices
THIS “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” (this “Agreement”) is entered into as of this 30th day of November, 2016 in Beijing by and among:
Proprietary & Strictly Confidential) UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD. AMENDED AND RESTATED AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 20th, 2021 • Chipmos Technologies Inc • Semiconductors & related devices
THIS “AMENDED AND RESTATED AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” (this “Agreement”) is entered into as of this 11th day of May, 2020 in Beijing by and among:
CONTRACT ON A SINO-FOREIGN EQUITY JOINT VENTURE SICHUAN JIHAI LITHIUM LTD.Sino-Foreign Equity Joint Venture Agreement • April 11th, 2005 • Sterling Group Ventures Inc • Mining & quarrying of nonmetallic minerals (no fuels)
Micro Express Ltd. A corporate entity incorporated and validly existing under the laws of the British Virgin Islands, holding a business license with a registration number 124770
Unimos Microelectronics (Shanghai) Co., Ltd. The 3rd Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 25th, 2019 • Chipmos Technologies Inc • Semiconductors & related devices
WHEREAS, Tibet Unigroup GuoWei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Gongqingcheng Changhou Investment Management Ltd., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017 and November 28, 2017 for the matter of joint venture of ChipMOS TECHNOLOGIES (Shanghai) LTD. (“ChipMOS Shanghai”);
Unimos Microelectronics (Shanghai) Co., Ltd. The 6th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURESino-Foreign Equity Joint Venture Agreement • April 23rd, 2020 • Chipmos Technologies Inc • Semiconductors & related devices
WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the 1st, 2nd, and 3rd supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017 and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”). Furthermore, as the shareholder of Investor A, Beijing Unis Memory Technology Co., Ltd. made and executed the 4th and 5th supplemental agreements with the shareholders of the Company except Tibet Unigroup Guowei Investment Co., Ltd. on December 29, 2018 and February
