U.S. $2,000,000,000 TERM LOAN CREDIT AGREEMENT Dated as of August 19, 2019 Among APPLIED MATERIALS, INC. as Borrower THE INITIAL LENDERS NAMED HEREIN as Initial Lenders and JPMORGAN CHASE BANK, N.A., as Administrative Agent BANK OF AMERICA, N.A.,...Term Loan Credit Agreement • August 21st, 2019 • Applied Materials Inc /De • Semiconductors & related devices • New York
TERM LOAN CREDIT AGREEMENT dated as of August 19, 2019 among APPLIED MATERIALS, INC., a Delaware corporation (the “Borrower”), the banks, financial institutions and other institutional lenders (the “Initial Lenders”) listed on the signature pages hereof, and JPMORGAN CHASE BANK, N.A., as Administrative Agent.
AMENDMENT NO. 2 TO CREDIT AGREEMENTCredit Agreement • August 21st, 2019 • Applied Materials Inc /De • Semiconductors & related devices • New York
AMENDMENT NO. 2 (this “Agreement”), dated as of August 19, 2019, to the Credit Agreement, dated as of September 3, 2015 (as amended by that certain Extension Agreement, dated as of September 3, 2017, the “Existing Credit Agreement”, and the Existing Credit Agreement as amended by this Agreement, the “Credit Agreement”), among Applied Materials, Inc. (the “Borrower”), the lenders from time to time party thereto (the “Lenders”), and JPMorgan Chase Bank, N.A., as administrative agent for the Lenders (in such capacity, the “Administrative Agent”).
