0001193125-20-115821 Sample Contracts

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First Supplemental Agreement to Syndicated Loan Agreement
Syndicated Loan Agreement • April 23rd, 2020 • Chipmos Technologies Inc • Semiconductors & related devices
The 7th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE
Sino-Foreign Equity Joint Venture Agreement • April 23rd, 2020 • Chipmos Technologies Inc • Semiconductors & related devices

WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd. ("Investor A"), ChipMOS TECHNOLOGIES (BVI) LTD. ("Investor B"), Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) (the parties hereunder other than Investor A and Investor B shall be referred to as "Investor C" individually or collectively) made and executed the "AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE" and the 1st, 2nd, and 3rd supplemental agreements thereof (hereinafter collectively referred to as "JV Agreement") respectively on November 30, 2016, April 10, 2017, November 28, 2017 and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. ("Unimos Shanghai" or the "Company"). Furthermore, as the shareholder of Investor A, Beijing Unis Memory Technology Co., Ltd. made and executed the

Unimos Microelectronics (Shanghai) Co., Ltd. The 6th Supplemental Agreement for AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE
Sino-Foreign Equity Joint Venture Agreement • April 23rd, 2020 • Chipmos Technologies Inc • Semiconductors & related devices

WHEREAS, Tibet Unigroup Guowei Investment Co., Ltd., ChipMOS TECHNOLOGIES (BVI) LTD., Accretech (China) Co., Ltd., Chao-Jung Tsai, Shih-Jye Cheng, Shanghai Zuzhu Business Consulting Partnership (Limited Partnership), Shou-Kang Chen, David W. Wang, and Gongqingcheng Changhou Hong Xin Investment Management Partnership (Limited Partnership) made and executed the “AGREEMENT FOR SINO-FOREIGN EQUITY JOINT VENTURE” and the 1st, 2nd, and 3rd supplemental agreements thereof (hereinafter collectively referred to as “JV Agreement”) respectively on November 30, 2016, April 10, 2017, November 28, 2017 and August 1, 2018, for the matter of joint venture of Unimos Microelectronics (Shanghai) Co., Ltd. (“Unimos Shanghai” or the “Company”). Furthermore, as the shareholder of Investor A, Beijing Unis Memory Technology Co., Ltd. made and executed the 4th and 5th supplemental agreements with the shareholders of the Company except Tibet Unigroup Guowei Investment Co., Ltd. on December 29, 2018 and February

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