AMENDED AND RESTATED FACILITY AGREEMENT DATED 14 JUNE 2023 US$150,000,000Facility Agreement • June 20th, 2023 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Pursuant to Clause 20.4 (Collateral Report) of the Facility Agreement dated ____ between, among others, TTM Technologies Enterprises (HK) Limited as a Borrower and The Hongkong and Shanghai Banking Corporation Limited as the Arranger, Original Lender, Issuing Bank, Facility Agent and Security Trustee, I certify that all information furnished in this Collateral Report is true, accurate and complete.
