HONG KONG DEBENTURE DATED 22 January 2021Debenture Agreement • January 26th, 2021 • Diodes Inc /Del/ • Semiconductors & related devices • Hong Kong
between DIODES HONG KONG LIMITED as Borrower and THE HONGKONG AND SHANGHAI BANKING CORPORATION LIMITED as Security Agent
ContractFacility Agreement • January 26th, 2021 • Diodes Inc /Del/ • Semiconductors & related devices • Hong Kong
Portions of this Exhibit have omitted because the information contained in such portions is both not material and would likely cause competitive harm to the registrant if publicly disclosed. Such portions are indicated in the Exhibit by [ ].
