Bridge Loan Escrow Agreement Sample Contracts

BRIDGE LOAN ESCROW AGREEMENT

Bridge Loan Escrow Agreement • August 9th, 2005 • Dpac Technologies Corp • Semiconductors & related devices • Pennsylvania

• Contract Type
  Bridge Loan Escrow Agreement
• Filed
  August 9th, 2005
• Company
  Dpac Technologies Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Pennsylvania

This Escrow Agreement is made as of this 29th day of July, 2005, by and among DEVELOPMENT CAPITAL VENTURES, LP (the “Lender”), DPAC TECHNOLOGIES CORP. (the “Borrower”), and BUCHANAN INGERSOLL PC (the “Escrow Agent”).