THIS LOANS RENEWAL AGREEMENT (hereinafter referred as this ‘Agreement’) is entered into on March 5, 2004 by Party A: Leshan Phoenix Semiconductor Co. Ltd. Party B: Industrial and Commercial Bank of China, Leshan City BranchLoans Renewal Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices
In accordance with the friendly mutual consultation by Party A and Party B, NOW it is therefore agreed to make the following supplements to the ‘LOAN FACILITY’ which was signed by the parties on November 17, 2000, in an amount equal to Twenty Million US Dollars (US$20,000,000) which was divided into two separate loan facilities; one of RMB33,200,000 (the ‘RMB Portion’) and one of US$16,000,000 (the ‘US$ Portion’):
