Execution Version NEW TERM LOAN JOINDER AGREEMENTNew Term Loan Joinder Agreement • May 5th, 2020 • New York
Contract Type FiledMay 5th, 2020 JurisdictionThis New Term Loan Joinder Agreement (this “Agreement”) dated as of December 10, 2012 to the Credit Agreement referenced below is by and among the Tranche C Lenders, the Borrowers and the Administrative Agent (each as defined below) under the Credit Agreement referenced below.
ContractNew Term Loan Joinder Agreement • March 3rd, 2017 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
Contract Type FiledMarch 3rd, 2017 Company Industry JurisdictionThis 2016 New Term Loan Joinder Agreement (this “Agreement”) dated as of September 22, 2016 to the Credit Agreement referenced below is by and among the Tranche F Lenders, the Borrowers and the Administrative Agent (each as defined below) under the Credit Agreement referenced below.
NEW TERM LOAN JOINDER AGREEMENTNew Term Loan Joinder Agreement • March 13th, 2012 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
Contract Type FiledMarch 13th, 2012 Company Industry JurisdictionThis New Term Loan Joinder Agreement (this “Agreement”) dated as of February 16, 2012 to the Credit Agreement referenced below is by and among the Tranche B Lenders, the Borrowers and the Administrative Agent (each as defined below) under the Credit Agreement referenced below.