New Term Loan Joinder Agreement Sample Contracts

NEW TERM LOAN JOINDER AGREEMENT

New Term Loan Joinder Agreement • March 1st, 2013 • NXP Semiconductors N.V. • Semiconductors & related devices • New York

• Contract Type
  New Term Loan Joinder Agreement
• Filed
  March 1st, 2013
• Company
  NXP Semiconductors N.V.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

This New Term Loan Joinder Agreement (this “Agreement”) dated as of December 10, 2012 to the Credit Agreement referenced below is by and among the Tranche C Lenders, the Borrowers and the Administrative Agent (each as defined below) under the Credit Agreement referenced below.

NEW TERM LOAN JOINDER AGREEMENT

New Term Loan Joinder Agreement • March 13th, 2012 • NXP Semiconductors N.V. • Semiconductors & related devices • New York

• Contract Type
  New Term Loan Joinder Agreement
• Filed
  March 13th, 2012
• Company
  NXP Semiconductors N.V.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

This New Term Loan Joinder Agreement (this “Agreement”) dated as of February 16, 2012 to the Credit Agreement referenced below is by and among the Tranche B Lenders, the Borrowers and the Administrative Agent (each as defined below) under the Credit Agreement referenced below.