Payoff of Indebtedness and Lien Release Sample Contracts

May 13, 2011

Payoff of Indebtedness and Lien Release • May 17th, 2011 • Epicor Software Corp • Services-prepackaged software • New York

• Contract Type
  Payoff of Indebtedness and Lien Release
• Filed
  May 17th, 2011
• Company
  Epicor Software Corp
• Industry
  Services-prepackaged software
• Jurisdiction
  New York

Reference is made to the Credit Agreement, dated as of December 16, 2007 (as amended, the “Credit Agreement”), among Epicor Software Corporation (“Borrower”), the guarantors party thereto, the lenders party thereto (the “Lenders”) and Bank of America, N.A., as administrative agent, swing line lender and L/C issuer (in such capacity, the “Administrative Agent”).